EEWORLDEEWORLDEEWORLD

Part Number

Search

MT18JBF25672PY-80BXX

Description
DDR DRAM Module, 512MX4, CMOS, LEAD FREE, RDIMM-240
Categorystorage    storage   
File Size834KB,21 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT18JBF25672PY-80BXX Overview

DDR DRAM Module, 512MX4, CMOS, LEAD FREE, RDIMM-240

MT18JBF25672PY-80BXX Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeDIMM
package instructionDIMM,
Contacts240
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
access modeSINGLE BANK PAGE BURST
Other featuresSELF CONTAINED REFRESH; WD-MAX
JESD-30 codeR-XDMA-N240
length133.35 mm
memory density2147483648 bit
Memory IC TypeDDR DRAM MODULE
memory width4
Number of functions1
Number of ports1
Number of terminals240
word count536870912 words
character code512000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512MX4
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Maximum seat height18 mm
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1 mm
Terminal locationDUAL
width4 mm
Base Number Matches1
2GB (x72, ECC, SR) 240-Pin DDR3 SDRAM VLP RDIMM
Features
DDR3 SDRAM VLP RDIMM
MT18JBF25672P – 2GB
MT18JBZF25672P – 2GB
For component data sheets, refer to Micron’s Web site:
www.micron.com
Features
• DDR3 functionality and operations supported as
defined in the component data sheet
• 240-pin, very low profile registered dual in-line
memory module (VLP RDIMM)
• Compatible with ATCA form factors
• Fast data transfer rates: PC3-10600, PC3-8500,
or PC3-6400
• 2GB (256 Meg x 72)
• V
DD
= 1.5V ±0.075V
• V
DDSPD
= +3.0V to +3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data and strobe signals
• Single rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus
Figure 1:
240-Pin VLP RDIMM
(ATCA Compatible R/C M)
PCB height: 17.9mm (0.705in)
Options
Marking
• Full module heat spreader
Z
1
• Operating temperature
Commercial (0°C
T
A
+70°C)
None
Industrial (–40°C
T
A
+85°C)
I
• Package
240-pin DIMM
Y
• Frequency/CAS latency
1.5ns @ CL = 8 (DDR3-1333)
2
-1G5
1.5ns @ CL = 9 (DDR3-1333)
-1G4
2
1.5ns @ CL = 10 (DDR3-1333)
-1G3
1.87ns @ CL = 7 (DDR3-1066)
-1G1
2
1.87ns @ CL = 8 (DDR3-1066)
-1G0
2
2.5ns @ CL = 5 (DDR3-800)
-80C
2
2.5ns @ CL = 6 (DDR3-800)
-80B
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. Not recommended for new designs.
Table 1:
Speed
Grade
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Key Timing Parameters
Data Rate (MT/s)
Industry
Nomenclature
PC3-10600
PC3-10600
PC3-10600
PC3-8500
PC3-8500
PC3-6400
PC3-6400
CL = 10
1333
1333
1333
CL = 9
1333
1333
CL = 8
1333
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
800
800
CL = 5
800
800
t
RCD
(ns)
12
13.5
15
RP
(ns)
12
13.5
15
13.125
15
12.5
15
t
RC
(ns)
48
49.5
51
50.625
52.5
50
52.5
t
13.125
15
12.5
15
PDF: 09005aef83244ee6/Source: 09005aef83244f69
JBF18C256x72PY.fm - Rev. B 6/08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Wince and mobile communication group 2 Group number: 68385705, welcome people who are doing low-level and upper-level software development in Wince and Mobile to join, there are still some places available
Wince and mobile communication group 2 Group number: 68385705, welcome people who are engaged in Wince and Mobile low-level and upper-level software development to join, and there are still some place...
dxlzwl Embedded System
Tips on how to modify the original battery to enhance the battery of digital camera
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:57[/i]One of the characteristics of SONY is that the standard configuration is low. For example, the memory card, 8M capacity is simply...
lorant Mobile and portable
[2011 National Competition Question Discussion Post] Question G: Simple Automatic Resistance Tester
The 2011 National College Student Competition test paper has been announced. If contestants have any questions about Question G of the competition, they can post them here !We look forward to the enth...
EEWORLD社区 Electronics Design Contest
Looking for a way to learn MSP430 LaunchPad together
I received an MSP430 LaunchPad from TI when I was about to graduate:victory: I am currently learning this board at home. I have a basic knowledge of 51 and a little knowledge of 430. After all, one pe...
wake6120 Microcontroller MCU
Can C# mobile program PPC 2003 connect to ODBC data source?
I want to make a program on PDA to connect to ACCESS database! How to do it? Experts, please tell me the steps!! Please give me the code!!!...
hargendazs Embedded System
TLP3547 Review (Part 1)
TLP3547 evaluation is based on the existing conditions and my own evaluation of device selectivity. 1. Under the conditions of similar electrical parameters, TLP3547 has a smaller PCB space for applic...
蓝雨夜 Toshiba Photorelays TLP3547 Review

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1125  899  652  919  1948  23  19  14  40  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号