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CM201212-3N9ML

Description
General Purpose Inductor, 0.0039uH, 20%, 1 Element, Polymer-Core, SMD, CHIP
CategoryPassive components    inductor   
File Size443KB,7 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance  
Download Datasheet Parametric Compare View All

CM201212-3N9ML Overview

General Purpose Inductor, 0.0039uH, 20%, 1 Element, Polymer-Core, SMD, CHIP

CM201212-3N9ML Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBourns
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
core materialPOLYMER
DC Resistance0.1 Ω
Nominal inductance(L)0.0039 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee3
Number of functions1
Number of terminals2
Maximum operating temperature100 °C
Minimum operating temperature-20 °C
Minimum quality factor (at nominal inductance)6
Maximum rated current0.54 A
self resonant frequency6000 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin (Sn)
Terminal locationDUAL ENDED
Terminal shapeJ BEND
Test frequency100 MHz
Tolerance20%
Base Number Matches1
Features
I
Applications
I
I
I
22
0K
I
I
I
High resistance to heat and humidity
Resistance to mechanical shock and
pressure
Accurate dimensions for automatic
surface mounting
Wide inductance range
(1.0nH to 1000uH)
Mobil phones
Cellular phones
CTV, VCR, HIC, FDD
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
General Specifications
Temperature Rise ........................................................................................................................................................................................20˚C max.
Ambient Temperature................................................................................................................................................................................. 80˚C max.
Operating Temperature......................................................................................................................................................................-20°C to +100°C
Storage Temperature ........................................................................................................................................................................-40°C to +100°C
Resistance to Soldering Heat..........................................................................................................................................................260˚C, 5 seconds
Materials
Core Material
CM10, CM16 .................................................................................................................................................................................Alumina Ceramic
CM20 ..............................................................................................................................................................................Polymer 3.9nH to 1000nH
CM25 .................................................................................................................................................................................Polymer 10nH to 180nH
CM32 .................................................................................................................................................................................Polymer 47nH to 180nH
Ferrite Core
CM25..............................................................................................................................................................................................220nH to 100uH
CM32 ..........................................................................................................................................................................................................220nH +
CM45 ....................................................................................................................................................................................................................All
Coil Type
CM10, CM16 ....................................................................................................................................................................................Copper plating
CM20, CM25, CM32, CM45 .................................................................................................................................................................Copper wire
Enclosure
CM10, CM16 ...................................................................................................................................................................................................Resin
CM20, CM25, CM32, CM45 ..................................................................................................................................................................Epoxy resin
Product Dimensions
CM100505, CM160808
CM10:
0.2
±
0.1
(.008
±
.004)
CM16:
0.3
±
0.15
(.012
±
.006)
CM10:
0.2
±
0.1
(.008
±
.004)
CM16:
0.3
±
0.15
(.012
±
.006)
CM201212
1.27
±
0.30
(.050
±
.012)
CM10:
0.5
±
0.1
(.020
±
.004)
CM16:
0.80
±
0.15
(.032
±
.006)
1.00
±
0.10
(. 039
±
.004)
CM10:
1.0
±
0.1
(.040
±
.004)
CM16:
1.6
±
0.15
(.063
±
.006)
CM10:
0.5
±
0.1
(.020
±
.004)
CM16:
0.80
±
0.15
(.032
±
.006)
1.27
±
0.20
(.050
±
.008)
DIMENSIONS ARE:
MM
(INCHES)
1.20
(.047)
2.0 + 0.30 - 0.20
(.079 + .012 - .008)
CM252016
Marking
CM322522
Marking
CM453232
Marking
2.0
(.079)
1.2
(.047)
2.5
(.079)
1.9
(.075)
3.2
(.125)
4.5
(.177)
1.2
(.047)
2.5
(.10)
1.6
(.063)
3.2
(.126)
2.2
(.086)
3.2
±
0.2
(.125
±
.008)
1.7
±
0.2
(.066
±
.008)
0.4
(.016)
0.6
(.024)
1.0
(.039)
1.0
(.039)
Recommended Land Pattern Dimensions
Model
CM10
CM16
CM20
CM25
CM32
CM45
a
0.5 to 0.6 (.019 to .023)
0.8 to 1.0 (.032 to .039)
1.0 to 1.2 (.039 to .047)
1.4 to 1.5 (.055 to .059)
1.6 to 2.0 (.063 to .079)
2.4 to 2.6 (.094 to .102)
b
1.5 to 1.7 (.059 to .067)
2.0 to 2.6 (.079 to .102)
3.0 to 3.8 (.118 to .150)
3.5 to 4.0 (.138 to .157)
4.0 to 4.6 (.157 to .181)
5.5 to 6.0 (.217 to .236)
c
0.5 to 0.6 (.019 to .023)
0.7 to 0.9 (.028 to .035)
0.9 to 1.3 (.028 to .051)
1.2 to 1.6 (.047 to .063)
1.9 to 2.4 (.075 to .094)
2.0 to 3.0 (.079 to .118)
c
a
b
Specifications are subject to change without notice.

CM201212-3N9ML Related Products

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Description General Purpose Inductor, 0.0039uH, 20%, 1 Element, Polymer-Core, SMD, CHIP General Purpose Inductor, 0.0056uH, 20%, 1 Element, Polymer-Core, SMD, CHIP General Purpose Inductor, 0.0068uH, 20%, 1 Element, Polymer-Core, SMD, CHIP General Purpose Inductor, 0.0082uH, 20%, 1 Element, Polymer-Core, SMD, CHIP Modular connectors
Is it lead-free? Lead free Lead free Lead free Lead free -
Is it Rohs certified? conform to conform to conform to conform to -
Maker Bourns Bourns Bourns Bourns -
Reach Compliance Code compliant compliant compliant compliant -
ECCN code EAR99 EAR99 EAR99 EAR99 -
Is Samacsys N N N N -
core material POLYMER POLYMER POLYMER POLYMER -
DC Resistance 0.1 Ω 0.12 Ω 0.15 Ω 0.16 Ω -
Nominal inductance(L) 0.0039 µH 0.0056 µH 0.0068 µH 0.0082 µH -
Inductor Applications RF INDUCTOR RF INDUCTOR RF INDUCTOR RF INDUCTOR -
Inductor type GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR GENERAL PURPOSE INDUCTOR -
JESD-609 code e3 e3 e3 e3 -
Number of functions 1 1 1 1 -
Number of terminals 2 2 2 2 -
Maximum operating temperature 100 °C 100 °C 100 °C 100 °C -
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -
Minimum quality factor (at nominal inductance) 6 6 8 8 -
Maximum rated current 0.54 A 0.54 A 0.54 A 0.54 A -
self resonant frequency 6000 MHz 5000 MHz 5000 MHz 5000 MHz -
Shape/Size Description RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE RECTANGULAR PACKAGE -
shield NO NO NO NO -
surface mount YES YES YES YES -
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn) -
Terminal location DUAL ENDED DUAL ENDED DUAL ENDED DUAL ENDED -
Terminal shape J BEND J BEND J BEND J BEND -
Test frequency 100 MHz 100 MHz 100 MHz 100 MHz -
Tolerance 20% 20% 20% 20% -
Base Number Matches 1 1 1 1 -
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