HN62W448TT-12 datasheet, PDF - EEWORLD Datasheet

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HN62W448TT-12: DescriptionMASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, TSOP2-44; Categorystorage storage; File Size80KB，12 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HN62W448TT-12 Overview

MASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, TSOP2-44

HN62W448TT-12 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP44,.46,32
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
Maximum access time	120 ns
Other features	USER CONFIGURABLE AS 512K X 16
Spare memory width	8
JESD-30 code	R-PDSO-G44
JESD-609 code	e0
length	18.41 mm
memory density	8388608 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	44
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00003 A
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm
Base Number Matches	1

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HN62W448 Series

524288-word

16-bit/1048576-word

8-bit CMOS Mask

Programmable ROM

ADE-203-544 (Z)

Preliminary

Rev. 0.0

May. 22, 1996

Description

The Hitachi HN62W448 is a 8-Mbit CMOS mask-programmable ROM organized either as 524288-words by

16-bits or as 1048576-words by 8-bits. Realizing low power consumption with low voltage operation, this

memory is allowed for battery operation. And low voltage high speed access of 120/150 ns are realized.

Features

•

Low voltage operation : 3.3 V

0.3 V

•

Normal access time: 120/150 ns (max)

•

Low power dissipation



Active: 150 mW (max)



Standby: 3

µW

(max)

•

Byte-wide or word-wide data organization (Switched by BHE terminal)

•

Three-state data output for wired or-tying

•

Directly LVTTL compatible (All inputs and outputs)

Ordering Information

Type No.

HN62W448P-12

HN62W448P-15

HN62W448FB-12

HN62W448FB-15

HN62W448TT-12

HN62W448TT-15

Access time

120 ns

150 ns

120 ns

150 ns

120 ns

150 ns

Package

600mil 42-pin plastic DIP (DP-42)

44-pin plastic SOP (FP-44D)

44-pin plastic TSOP II (TTP-44D)

Preliminary: This document contains information an a new product. Specifications and information

contained herein are subject to change without notice.

HN62W448TT-12 Related Products

	HN62W448TT-12	HN62W448FB-12	HN62W448P-12	HN62W448TT-15	HN62W448P-15	HN62W448FB-15
Description	MASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, TSOP2-44	MASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, SOP-44	MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 512KX16, 150ns, CMOS, PDSO44, PLASTIC, TSOP2-44	MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42	MASK ROM, 512KX16, 150ns, CMOS, PDSO44, PLASTIC, SOP-44
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	TSOP2	SOIC	DIP	TSOP2	DIP	SOIC
package instruction	TSOP2, TSOP44,.46,32	SOP, SOP44,.63	DIP, DIP42,.6	TSOP2,	DIP,	SOP,
Contacts	44	44	42	44	42	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	120 ns	120 ns	150 ns	150 ns	150 ns
Other features	USER CONFIGURABLE AS 512K X 16	USER CONFIGURABLE AS 512K X 16	USER CONFIGURABLE AS 512K X 16	USER CONFIGURABLE AS 512K X 16	USER CONFIGURABLE AS 512K X 16	USER CONFIGURABLE AS 512K X 16
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDIP-T42	R-PDSO-G44	R-PDIP-T42	R-PDSO-G44
length	18.41 mm	28.5 mm	52.8 mm	18.41 mm	52.8 mm	28.5 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	44	44	42	44	42	44
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	SOP	DIP	TSOP2	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	3 mm	5.06 mm	1.2 mm	5.06 mm	3 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	0.8 mm	1.27 mm	2.54 mm	0.8 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	10.16 mm	12.6 mm	15.24 mm	10.16 mm	15.24 mm	12.6 mm

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