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HN62W448P-15

Description
MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42
Categorystorage    storage   
File Size80KB,12 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HN62W448P-15 Overview

MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42

HN62W448P-15 Parametric

Parameter NameAttribute value
MakerHitachi (Renesas )
Parts packaging codeDIP
package instructionDIP,
Contacts42
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time150 ns
Other featuresUSER CONFIGURABLE AS 512K X 16
JESD-30 codeR-PDIP-T42
length52.8 mm
memory density8388608 bit
Memory IC TypeMASK ROM
memory width16
Number of functions1
Number of terminals42
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX16
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.06 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
HN62W448 Series
524288-word
×
16-bit/1048576-word
×
8-bit CMOS Mask
Programmable ROM
ADE-203-544 (Z)
Preliminary
Rev. 0.0
May. 22, 1996
Description
The Hitachi HN62W448 is a 8-Mbit CMOS mask-programmable ROM organized either as 524288-words by
16-bits or as 1048576-words by 8-bits. Realizing low power consumption with low voltage operation, this
memory is allowed for battery operation. And low voltage high speed access of 120/150 ns are realized.
Features
Low voltage operation : 3.3 V
±
0.3 V
Normal access time: 120/150 ns (max)
Low power dissipation
Active: 150 mW (max)
Standby: 3
µW
(max)
Byte-wide or word-wide data organization (Switched by BHE terminal)
Three-state data output for wired or-tying
Directly LVTTL compatible (All inputs and outputs)
Ordering Information
Type No.
HN62W448P-12
HN62W448P-15
HN62W448FB-12
HN62W448FB-15
HN62W448TT-12
HN62W448TT-15
Access time
120 ns
150 ns
120 ns
150 ns
120 ns
150 ns
Package
600mil 42-pin plastic DIP (DP-42)
44-pin plastic SOP (FP-44D)
44-pin plastic TSOP II (TTP-44D)
Preliminary: This document contains information an a new product. Specifications and information
contained herein are subject to change without notice.

HN62W448P-15 Related Products

HN62W448P-15 HN62W448FB-12 HN62W448P-12 HN62W448TT-12 HN62W448TT-15 HN62W448FB-15
Description MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 MASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, SOP-44 MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 MASK ROM, 512KX16, 120ns, CMOS, PDSO44, PLASTIC, TSOP2-44 MASK ROM, 512KX16, 150ns, CMOS, PDSO44, PLASTIC, TSOP2-44 MASK ROM, 512KX16, 150ns, CMOS, PDSO44, PLASTIC, SOP-44
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code DIP SOIC DIP TSOP2 TSOP2 SOIC
package instruction DIP, SOP, SOP44,.63 DIP, DIP42,.6 TSOP2, TSOP44,.46,32 TSOP2, SOP,
Contacts 42 44 42 44 44 44
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 150 ns 120 ns 120 ns 120 ns 150 ns 150 ns
Other features USER CONFIGURABLE AS 512K X 16 USER CONFIGURABLE AS 512K X 16 USER CONFIGURABLE AS 512K X 16 USER CONFIGURABLE AS 512K X 16 USER CONFIGURABLE AS 512K X 16 USER CONFIGURABLE AS 512K X 16
JESD-30 code R-PDIP-T42 R-PDSO-G44 R-PDIP-T42 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44
length 52.8 mm 28.5 mm 52.8 mm 18.41 mm 18.41 mm 28.5 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1
Number of terminals 42 44 42 44 44 44
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP TSOP2 TSOP2 SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.06 mm 3 mm 5.06 mm 1.2 mm 1.2 mm 3 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO YES NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 0.8 mm 0.8 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 15.24 mm 12.6 mm 15.24 mm 10.16 mm 10.16 mm 12.6 mm
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