1KX8 OTPROM, CDIP24, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| DM87SR181J | DM87SR181N | DM87SR181V | DM87SR181VX | DM77SR181J | |
|---|---|---|---|---|---|
| Description | 1KX8 OTPROM, CDIP24, CERAMIC, DIP-24 | 1KX8 OTPROM, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 1KX8 OTPROM, PQCC28, PLASTIC, LCC-28 | 1KX8 OTPROM, PQCC28, PLASTIC, LCC-28 | 1KX8 OTPROM, CDIP24, CERAMIC, DIP-24 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | DIP | DIP | QLCC | QLCC | DIP |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | QCCJ, | DIP, DIP24,.3 |
| Contacts | 24 | 24 | 28 | 28 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-GDIP-T24 | R-PDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | R-GDIP-T24 |
| memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 28 | 28 | 24 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | QCCJ | QCCJ | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.572 mm | 5.334 mm | 4.57 mm | 4.57 mm | 4.572 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL |
| width | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | - | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible |
| JESD-609 code | e0 | e0 | e0 | - | e0 |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | LDCC28,.5SQ | - | DIP24,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | - | 5 V |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| length | - | 31.915 mm | 11.43 mm | 11.43 mm | - |
京公网安备 11010802033920号
EEWORLD
