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HCF4504BEY

Description
HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size237KB,6 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

HCF4504BEY Overview

HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16

HCF4504BEY Parametric

Parameter NameAttribute value
MakerSTMicroelectronics
Parts packaging codeDIP
package instructionPLASTIC, DIP-16
Contacts16
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
maximum delay
Interface integrated circuit typeTTL/CMOS TO CMOS TRANSLATOR
JESD-30 codeR-PDIP-T16
Number of digits1
Number of functions6
Number of terminals16
Output latch or registerNONE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply3/18 V
Certification statusNot Qualified
Maximum seat height5.1 mm
surface mountNO
technologyCMOS
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1
HCC4504B
HCF4504B
HEX TTL OR CMOS TO CMOS LEVEL SHIFTER
.
.
.
.
.
PRODUCT PREVIEW
VERY LOW QUIESCENT CURRENT
HIGH NOISE IMMUNITY
SUPPLY VOLTAGE RANGE 3V TO 18V FOR
V
DD
AND V
CC
UP TRANSLATES FROM A LOW TO A HIGH
VOLTAGE OR DOWN TRANSLATES FROM A
HIGH TO A LOW VOLTAGE
INPUT THRESHOLD CAN BE SHIFTED FOR
TTL COMPATIBILITY
EY
(Plastic Package)
F
(Ceramic Frit Seal Package)
M1
C1
(Micro Package)
(Plastic Chip Carrier)
ORDER CODES :
HCC4504 BF
HCF4504 BM1
HCF4504 BEY
HCF4504 BC1
PIN CONNECTION
(top view)
DESCRIPTION
The HCC4504B and HCF4504B are monolithic in-
tegrated circuits, available in 16-lead dual-in-line
plastic or ceramic packages or in 16-pin SO micro-
packages.
The HCC4504B and HCF4504B are hex non-invert-
ing level shifters. They will shift a TTL signal to
CMOS logic levels for any CMOS supply voltage be-
tween 5V and 15V. A control input also allows inter-
face from CMOS to CMOS at one logic level to
another logic level. Either up or down level translat-
ing is accomplished by selection of power supply le-
vels V
DD
and V
CC
. The V
CC
level sets the input signal
levels ; V
DD
selects the output voltage levels.
The supply current is typically 1nA at V
DD
= 10V for
CMOS to CMOS operation. For TTL to CMOS trans-
lation the supply current is typically 2.5mA taken
from V
CC
.
September 1990
1/6

HCF4504BEY Related Products

HCF4504BEY HCC4504BF HCF4504BC1
Description HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PQCC20, PLASTIC, LCC-20
Maker STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code DIP DIP QLCC
package instruction PLASTIC, DIP-16 FRIT SEALED, CERAMIC, DIP-16 PLASTIC, LCC-20
Contacts 16 16 20
Reach Compliance Code unknown compliant compliant
ECCN code EAR99 EAR99 EAR99
Is Samacsys N N N
Interface integrated circuit type TTL/CMOS TO CMOS TRANSLATOR TTL/CMOS TO CMOS TRANSLATOR TTL/CMOS TO CMOS TRANSLATOR
JESD-30 code R-PDIP-T16 R-GDIP-T16 S-PQCC-J20
Number of digits 1 1 1
Number of functions 6 6 6
Number of terminals 16 16 20
Output latch or register NONE NONE NONE
Output polarity TRUE TRUE TRUE
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code DIP DIP QCCJ
Encapsulate equivalent code DIP16,.3 DIP16,.3 LDCC20,.4SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE IN-LINE CHIP CARRIER
power supply 3/18 V 3/18 V 3/18 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 5.1 mm 5.08 mm 4.57 mm
surface mount NO NO YES
technology CMOS CMOS CMOS
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL QUAD
width 7.62 mm 7.62 mm 8.9662 mm
Base Number Matches 1 1 1
length - 19.43 mm 8.9662 mm

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