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HCF4504BC1

Description
HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PQCC20, PLASTIC, LCC-20
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size237KB,6 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

HCF4504BC1 Overview

HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PQCC20, PLASTIC, LCC-20

HCF4504BC1 Parametric

Parameter NameAttribute value
MakerSTMicroelectronics
Parts packaging codeQLCC
package instructionPLASTIC, LCC-20
Contacts20
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
maximum delay
Interface integrated circuit typeTTL/CMOS TO CMOS TRANSLATOR
JESD-30 codeS-PQCC-J20
length8.9662 mm
Number of digits1
Number of functions6
Number of terminals20
Output latch or registerNONE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC20,.4SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply3/18 V
Certification statusNot Qualified
Maximum seat height4.57 mm
surface mountYES
technologyCMOS
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width8.9662 mm
Base Number Matches1
HCC4504B
HCF4504B
HEX TTL OR CMOS TO CMOS LEVEL SHIFTER
.
.
.
.
.
PRODUCT PREVIEW
VERY LOW QUIESCENT CURRENT
HIGH NOISE IMMUNITY
SUPPLY VOLTAGE RANGE 3V TO 18V FOR
V
DD
AND V
CC
UP TRANSLATES FROM A LOW TO A HIGH
VOLTAGE OR DOWN TRANSLATES FROM A
HIGH TO A LOW VOLTAGE
INPUT THRESHOLD CAN BE SHIFTED FOR
TTL COMPATIBILITY
EY
(Plastic Package)
F
(Ceramic Frit Seal Package)
M1
C1
(Micro Package)
(Plastic Chip Carrier)
ORDER CODES :
HCC4504 BF
HCF4504 BM1
HCF4504 BEY
HCF4504 BC1
PIN CONNECTION
(top view)
DESCRIPTION
The HCC4504B and HCF4504B are monolithic in-
tegrated circuits, available in 16-lead dual-in-line
plastic or ceramic packages or in 16-pin SO micro-
packages.
The HCC4504B and HCF4504B are hex non-invert-
ing level shifters. They will shift a TTL signal to
CMOS logic levels for any CMOS supply voltage be-
tween 5V and 15V. A control input also allows inter-
face from CMOS to CMOS at one logic level to
another logic level. Either up or down level translat-
ing is accomplished by selection of power supply le-
vels V
DD
and V
CC
. The V
CC
level sets the input signal
levels ; V
DD
selects the output voltage levels.
The supply current is typically 1nA at V
DD
= 10V for
CMOS to CMOS operation. For TTL to CMOS trans-
lation the supply current is typically 2.5mA taken
from V
CC
.
September 1990
1/6

HCF4504BC1 Related Products

HCF4504BC1 HCC4504BF HCF4504BEY
Description HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PQCC20, PLASTIC, LCC-20 HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16 HEX TTL/CMOS TO CMOS TRANSLATOR, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16
Maker STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code QLCC DIP DIP
package instruction PLASTIC, LCC-20 FRIT SEALED, CERAMIC, DIP-16 PLASTIC, DIP-16
Contacts 20 16 16
Reach Compliance Code compliant compliant unknown
ECCN code EAR99 EAR99 EAR99
Is Samacsys N N N
Interface integrated circuit type TTL/CMOS TO CMOS TRANSLATOR TTL/CMOS TO CMOS TRANSLATOR TTL/CMOS TO CMOS TRANSLATOR
JESD-30 code S-PQCC-J20 R-GDIP-T16 R-PDIP-T16
Number of digits 1 1 1
Number of functions 6 6 6
Number of terminals 20 16 16
Output latch or register NONE NONE NONE
Output polarity TRUE TRUE TRUE
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code QCCJ DIP DIP
Encapsulate equivalent code LDCC20,.4SQ DIP16,.3 DIP16,.3
Package shape SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE IN-LINE
power supply 3/18 V 3/18 V 3/18 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 5.08 mm 5.1 mm
surface mount YES NO NO
technology CMOS CMOS CMOS
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm
Terminal location QUAD DUAL DUAL
width 8.9662 mm 7.62 mm 7.62 mm
Base Number Matches 1 1 1
length 8.9662 mm 19.43 mm -
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