CXP85400-U01Q datasheet, PDF - EEWORLD Datasheet

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CXP85400-U01Q: DescriptionMicroprocessor Circuit, CMOS, CQFP64, CERAMIC, PIGGY BACK, QFP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size324KB，12 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp; Environmental Compliance

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CXP85400-U01Q Overview

Microprocessor Circuit, CMOS, CQFP64, CERAMIC, PIGGY BACK, QFP-64

CXP85400-U01Q Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	QFP
package instruction	AQFP,
Contacts	64
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	R-CQFP-G64
JESD-609 code	e4
length	22.3 mm
Number of terminals	64
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	AQFP
Package shape	RECTANGULAR
Package form	FLATPACK, PIGGYBACK
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	9.8 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Gold (Au)
Terminal form	GULL WING
Terminal pitch	1 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	10
width	16.3 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

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CXP85400-U01Q Related Products

	CXP85400-U01Q	CXP85400-U01S	CXP85490-U01S
Description	Microprocessor Circuit, CMOS, CQFP64, CERAMIC, PIGGY BACK, QFP-64	Microprocessor Circuit, CMOS, CDIP64, 0.750 INCH, CERAMIC, PSDIP-64	Microprocessor Circuit, CMOS, CDIP64, 0.750 INCH, CERAMIC, PSDIP-64
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Parts packaging code	QFP	DIP	DIP
package instruction	AQFP,	ASDIP,	ASDIP,
Contacts	64	64	64
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-CQFP-G64	R-CDIP-T64	R-CDIP-T64
JESD-609 code	e4	e4	e4
length	22.3 mm	58.9 mm	70.98 mm
Number of terminals	64	64	64
Maximum operating temperature	75 °C	75 °C	75 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	AQFP	ASDIP	ASDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, PIGGYBACK	IN-LINE, PIGGYBACK, SHRINK PITCH	IN-LINE, PIGGYBACK, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	9.8 mm	9.8 mm	11.24 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Gold (Au)	Gold (Au)	Gold (Au)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1 mm	1.778 mm	1.778 mm
Terminal location	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	10	10	10
width	16.3 mm	19.05 mm	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Base Number Matches	1	1	1

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