CXP85490-U01S datasheet, PDF - EEWORLD Datasheet

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CXP85490-U01S: DescriptionMicroprocessor Circuit, CMOS, CDIP64, 0.750 INCH, CERAMIC, PSDIP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size324KB，12 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp; Environmental Compliance

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CXP85490-U01S Overview

Microprocessor Circuit, CMOS, CDIP64, 0.750 INCH, CERAMIC, PSDIP-64

CXP85490-U01S Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	DIP
package instruction	ASDIP,
Contacts	64
Reach Compliance Code	unknown
JESD-30 code	R-CDIP-T64
JESD-609 code	e4
length	70.98 mm
Number of terminals	64
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	ASDIP
Package shape	RECTANGULAR
Package form	IN-LINE, PIGGYBACK, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	11.24 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Gold (Au)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	10
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

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CXP85490-U01S Related Products

	CXP85490-U01S	CXP85400-U01Q	CXP85400-U01S
Description	Microprocessor Circuit, CMOS, CDIP64, 0.750 INCH, CERAMIC, PSDIP-64	Microprocessor Circuit, CMOS, CQFP64, CERAMIC, PIGGY BACK, QFP-64	Microprocessor Circuit, CMOS, CDIP64, 0.750 INCH, CERAMIC, PSDIP-64
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Parts packaging code	DIP	QFP	DIP
package instruction	ASDIP,	AQFP,	ASDIP,
Contacts	64	64	64
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-CDIP-T64	R-CQFP-G64	R-CDIP-T64
JESD-609 code	e4	e4	e4
length	70.98 mm	22.3 mm	58.9 mm
Number of terminals	64	64	64
Maximum operating temperature	75 °C	75 °C	75 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	ASDIP	AQFP	ASDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, PIGGYBACK, SHRINK PITCH	FLATPACK, PIGGYBACK	IN-LINE, PIGGYBACK, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	11.24 mm	9.8 mm	9.8 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V
surface mount	NO	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Gold (Au)	Gold (Au)	Gold (Au)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	1.778 mm	1 mm	1.778 mm
Terminal location	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	10	10	10
width	19.05 mm	16.3 mm	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Base Number Matches	1	1	1

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