HB56UW3272E-6A datasheet, PDF - EEWORLD Datasheet

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HB56UW3272E-6A: DescriptionEDO DRAM Module, 32MX72, 60ns, CMOS, DUAL LEAD OUT, SOCKET TYPE, DIMM-168; Categorystorage storage; File Size156KB，18 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HB56UW3272E-6A Overview

EDO DRAM Module, 32MX72, 60ns, CMOS, DUAL LEAD OUT, SOCKET TYPE, DIMM-168

HB56UW3272E-6A Parametric

Parameter Name	Attribute value
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
access mode	FAST PAGE WITH EDO
Maximum access time	60 ns
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	2415919104 bit
Memory IC Type	EDO DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	33554432 words
character code	32000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	60.96 mm
Maximum standby current	0.046 A
Maximum slew rate	2.62 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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HB56UW3272 Series

33554432-word

72-bit High Density Dynamic RAM Module

ADE-203-638 (Z)

Preliminary

Rev. 0.0

Aug. 30, 1996

Description

The HB56UW3272 Series belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been

developed an optimized main memory solution for 4 and 8-byte processor applications. The

HB56UW3272E Series is a 32 M

72 Dynamic RAM Module, mounted 36 pieces of 64-Mbit DRAM

(HM5164405ATT) sealed in TSOP package and 2 pieces of 16-bit BiCMOS line driver (74LVT16244)

sealed in TSSOP package. The HB56UW3272EJ Series is a 32 M

72 Dynamic RAM Module, mounted

36 pieces of 64-Mbit DRAM (HM5164405AJ) sealed in SOJ package and 2 pieces of 16-bit BiCMOS line

driver (74LVT16244) sealed in TSSOP package. The HB56UW3272 Series offers Extended Data Out

(EDO) Page Mode as a high speed access mode. An outline of the HB56UW3272 Series is 168-pin socket

type package (dual lead out). Therefore, the HB56UW3272 Series makes high density mounting possible

without surface mount technology. The HB56UW3272 Series provides common data inputs and outputs.

Decoupling capacitors are mounted beside each TSOP or SOJ on the its module board.

Features

•

168-pin socket type package (Dual lead out)



Outline : 133.35 mm (Length)

60.96 mm (Height)

4.00 mm (Thickness) (HB56UW3272E

Series)

Outline : 176.53 (133.35) mm (Length)

41.91 mm (Height)

9.00 mm (Thickness)

(HB56UW3272EJ Series)



Lead pitch : 1.27 mm

•

Single 3.3 V supply (±0.3 V)

•

High speed



Access time: t

RAC

= 60 ns/70 ns (max)



Access time: t

CAC

= 20 ns/23 ns (max)

•

Low power dissipation



Active mode: 8.78 W/7.49W (max)



Standby mode (TTL): 295.2 mW (max)

•

JEDEC standard outline buffered 8-byte DIMM

Preliminary: This document contains information on a new product. Specifications and information

contained herein are subject to change without notice.

HB56UW3272E-6A Related Products

	HB56UW3272E-6A	HB56UW3272E-7A	HB56UW3272EJ-6A	HB56UW3272EJ-7A
Description	EDO DRAM Module, 32MX72, 60ns, CMOS, DUAL LEAD OUT, SOCKET TYPE, DIMM-168	EDO DRAM Module, 32MX72, 70ns, CMOS, DUAL LEAD OUT, SOCKET TYPE, DIMM-168	EDO DRAM Module, 32MX72, 60ns, CMOS, DUAL LEAD OUT, SOCKET TYPE, DIMM-168	EDO DRAM Module, 32MX72, 70ns, CMOS, DUAL LEAD OUT, SOCKET TYPE, DIMM-168
Parts packaging code	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168	168	168
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	60 ns	70 ns	60 ns	70 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
memory density	2415919104 bit	2415919104 bit	2415919104 bit	2415919104 bit
Memory IC Type	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE	EDO DRAM MODULE
memory width	72	72	72	72
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	168	168	168	168
word count	33554432 words	33554432 words	33554432 words	33554432 words
character code	32000000	32000000	32000000	32000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	32MX72	32MX72	32MX72	32MX72
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192	8192
Maximum seat height	60.96 mm	60.96 mm	41.91 mm	41.91 mm
Maximum standby current	0.046 A	0.046 A	0.046 A	0.046 A
Maximum slew rate	2.62 mA	2.26 mA	2.62 mA	2.26 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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