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ML2252-XXXGA

Description
Speech Synthesizer, 64.5s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size287KB,37 Pages
ManufacturerLAPIS Semiconductor Co., Ltd.
Download Datasheet Parametric Compare View All

ML2252-XXXGA Overview

Speech Synthesizer, 64.5s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44

ML2252-XXXGA Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionQFP, QFP44,.53X.57,32
Contacts44
Reach Compliance Codeunknown
Is SamacsysN
Other featuresALSO OPERATES AT 5V SUPPLY
Commercial integrated circuit typesSPEECH SYNTHESIZER
JESD-30 codeR-PQFP-G44
length10.5 mm
Number of functions1
Number of terminals44
On-chip memory typeMASK ROM
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP44,.53X.57,32
Package shapeRECTANGULAR
Package formFLATPACK
power supply3/5 V
Certification statusNot Qualified
Maximum read time64.5 s
Maximum seat height2.25 mm
Maximum slew rate40 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width9.5 mm
Base Number Matches1
OKI Semiconductor
ML2251/52/53/54/56-XXX,
ML22Q54/Q58
2-Channel Mixing Oki ADPCM Algorithm-Based Speech Synthesis LSI
FEDL2250DIGEST-09
Issue Date: Feb. 9, 2006
This document contains minimum specifications. For full specifications, please contact your nearest Oki office or
representative.
GENERAL DESCRIPTION
The ML2250 family is a 2-channel mixing speech synthesis device with an on-chip voice data (i.e., phrases)
storing mask ROM and a flash memory. Besides playing the built-in voice data, this device can output voice data
that is input from outside the device. This ML2250 family allows selecting the playback method from the 8-bit
PCM, non-linear 8-bit PCM, 16-bit PCM, 2-bit ADPCM2, and 4-bit ADPCM2 algorithms. And the sound volume
is adjustable as well.
The ML2250 family incorporates a 14-bit D/A converter and low-pass filter.
It is easy to configure a speech synthesizer by externally connecting a power amplifier and a CPU to the ML2250
family.
The ML2250 family line-up includes 2 types of products: with on-chip mask ROM, and with on-chip flash
memory.
ML2251/52/53/54/56-XXX
This is a CMOS single chip speech synthesis device with an on-chip mask ROM. Products with 5 types of mask
ROMs are available in the ML2250 family depending upon the total playback time length.
ML22Q54/Q58
The ML22Q54/Q58 is a speech synthesis device with a 4-Mbit flash memory built in. The voice data can be
easily written to the flash memory using a special tool. The on-chip flash memory product is suitable for the
diversified low volume production or short delivery time applications that the on-chip mask ROM product
cannot support. The ML22Q54/Q58 is most suitable for evaluation because the circuit configuration is the same
as the on-chip mask ROM product. As it is easy to write to build in-flash memory, it is able to combine fixed
message and variable message.
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ML2252-XXXGA Related Products

ML2252-XXXGA ML2251-XXXGA ML2254-XXXHB ML2254-XXXGA ML22Q54GA ML2253-XXXGA ML2253-XXXHB ML22Q58GA ML2256-XXXGA ML2256-XXXHB
Description Speech Synthesizer, 64.5s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 Speech Synthesizer, 31.7s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 Speech Synthesizer, 261.1s, CMOS, PBGA33, 5.03 X 5.78 MM, 0.80 MM PITCH, PLASTIC, VFLGA-33 Speech Synthesizer, 261.1s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 Speech Synthesizer, 261.1s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 Speech Synthesizer, 195.5s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 Speech Synthesizer, 195.5s, CMOS, PBGA33, 5.03 X 5.78 MM, 0.80 MM PITCH, PLASTIC, VFLGA-33 Speech Synthesizer, 522.2s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 Speech Synthesizer, 392.1s, CMOS, PQFP44, 9 X 10 MM, 0.80 MM PITCH, PLASTIC, QFP-44 Speech Synthesizer, 392.1s, CMOS, PBGA33, 6.82 X 5.16 MM, 0.80 MM PITCH, WCSP-33
Parts packaging code QFP QFP LGA QFP QFP QFP LGA QFP QFP BGA
package instruction QFP, QFP44,.53X.57,32 QFP, QFP44,.53X.57,32 VFBGA, LGA33,6X6,32 QFP, QFP44,.53X.57,32 QFP, QFP44,.53X.57,32 QFP, QFP44,.53X.57,32 VFBGA, LGA33,6X6,32 QFP, QFP44,.53X.57,32 QFP, QFP44,.53X.57,32 VFBGA, BGA33,6X6,32
Contacts 44 44 33 44 44 44 33 44 44 33
Reach Compliance Code unknown unknow unknown unknown unknown unknown unknown unknown unknown unknown
Other features ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY
Commercial integrated circuit types SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER
JESD-30 code R-PQFP-G44 R-PQFP-G44 R-PBGA-BU33 R-PQFP-G44 R-PQFP-G44 R-PQFP-G44 R-PBGA-BU33 R-PQFP-G44 R-PQFP-G44 R-PBGA-B33
length 10.5 mm 10.5 mm 5.78 mm 10.5 mm 10.5 mm 10.5 mm 5.78 mm 10.5 mm 10.5 mm 6.82 mm
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 44 44 33 44 44 44 33 44 44 33
On-chip memory type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 70 °C 85 °C 85 °C 70 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C - -40 °C -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP VFBGA QFP QFP QFP VFBGA QFP QFP VFBGA
Encapsulate equivalent code QFP44,.53X.57,32 QFP44,.53X.57,32 LGA33,6X6,32 QFP44,.53X.57,32 QFP44,.53X.57,32 QFP44,.53X.57,32 LGA33,6X6,32 QFP44,.53X.57,32 QFP44,.53X.57,32 BGA33,6X6,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK GRID ARRAY, VERY THIN PROFILE, FINE PITCH FLATPACK FLATPACK FLATPACK GRID ARRAY, VERY THIN PROFILE, FINE PITCH FLATPACK FLATPACK GRID ARRAY, VERY THIN PROFILE, FINE PITCH
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/3.3 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum read time 64.5 s 31.7 s 261.1 s 261.1 s 261.1 s 195.5 s 195.5 s 522.2 s 392.1 s 392.1 s
Maximum seat height 2.25 mm 2.25 mm 0.52 mm 2.25 mm 2.25 mm 2.25 mm 0.52 mm 2.25 mm 2.25 mm 0.52 mm
Maximum slew rate 40 mA 40 mA 40 mA 40 mA 60 mA 40 mA 40 mA 60 mA 40 mA 40 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.3 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING BUTT GULL WING GULL WING GULL WING BUTT GULL WING GULL WING BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD BOTTOM QUAD QUAD QUAD BOTTOM QUAD QUAD BOTTOM
width 9.5 mm 9.5 mm 5.03 mm 9.5 mm 9.5 mm 9.5 mm 5.03 mm 9.5 mm 9.5 mm 5.16 mm
Base Number Matches 1 1 1 1 1 1 1 - - -
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