EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Maximum access time | 150 ns |
| Data polling | YES |
| JESD-30 code | S-XQCC-J68 |
| JESD-609 code | e0 |
| memory density | 4194304 bit |
| Memory IC Type | EEPROM MODULE |
| memory width | 32 |
| Number of terminals | 68 |
| word count | 131072 words |
| character code | 128000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 128KX32 |
| Package body material | CERAMIC |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| page size | 128 words |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0015 A |
| Maximum slew rate | 0.25 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| switch bit | YES |
| write protect | SOFTWARE |
| Base Number Matches | 1 |
| EDI5C32128C150JI | EDI5C32128C150JM | EDI5C32128C120JC | EDI5C32128C120JI | EDI5C32128C120JM | EDI5C32128C200JI | EDI5C32128C200JM | EDI5C32128C200JC | |
|---|---|---|---|---|---|---|---|---|
| Description | EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68, | EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68, | EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQCC68, | EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQCC68, | EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQCC68, | EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68, | EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68, | EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 150 ns | 150 ns | 120 ns | 120 ns | 120 ns | 200 ns | 200 ns | 200 ns |
| Data polling | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 code | S-XQCC-J68 | S-XQCC-J68 | S-XQCC-J68 | S-XQCC-J68 | S-XQCC-J68 | S-XQCC-J68 | S-XQCC-J68 | S-XQCC-J68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE |
| memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| Maximum operating temperature | 85 °C | 125 °C | 70 °C | 85 °C | 125 °C | 85 °C | 125 °C | 70 °C |
| Minimum operating temperature | -40 °C | -55 °C | - | -40 °C | -55 °C | -40 °C | -55 °C | - |
| organize | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| page size | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A |
| Maximum slew rate | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | COMMERCIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| switch bit | YES | YES | YES | YES | YES | YES | YES | YES |
| write protect | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
| Maker | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |