EDI5C32128C200JM datasheet, PDF

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EDI5C32128C200JM: DescriptionEEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68,; Categorystorage storage; File Size440KB，9 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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EDI5C32128C200JM Overview

EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68,

EDI5C32128C200JM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
Reach Compliance Code	unknown
Maximum access time	200 ns
Data polling	YES
JESD-30 code	S-XQCC-J68
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	EEPROM MODULE
memory width	32
Number of terminals	68
word count	131072 words
character code	128000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	CERAMIC
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ
Package shape	SQUARE
Package form	CHIP CARRIER
page size	128 words
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.0015 A
Maximum slew rate	0.25 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
switch bit	YES
write protect	SOFTWARE

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Description	EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68,	EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68,	EEPROM Module, 128KX32, 150ns, Parallel, CMOS, CQCC68,	EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQCC68,	EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQCC68,	EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQCC68,	EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68,	EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CQCC68,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	200 ns	150 ns	150 ns	120 ns	120 ns	120 ns	200 ns	200 ns
Data polling	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-XQCC-J68	S-XQCC-J68	S-XQCC-J68	S-XQCC-J68	S-XQCC-J68	S-XQCC-J68	S-XQCC-J68	S-XQCC-J68
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE
memory width	32	32	32	32	32	32	32	32
Number of terminals	68	68	68	68	68	68	68	68
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000
Maximum operating temperature	125 °C	85 °C	125 °C	70 °C	85 °C	125 °C	85 °C	70 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-	-40 °C	-55 °C	-40 °C	-
organize	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
page size	128 words	128 words	128 words	128 words	128 words	128 words	128 words	128 words
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.0015 A	0.0015 A	0.0015 A	0.0015 A	0.0015 A	0.0015 A	0.0015 A	0.0015 A
Maximum slew rate	0.25 mA	0.25 mA	0.25 mA	0.25 mA	0.25 mA	0.25 mA	0.25 mA	0.25 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	MILITARY	COMMERCIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
switch bit	YES	YES	YES	YES	YES	YES	YES	YES
write protect	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE
Maker	White Electronic Designs Corporation	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation

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