Analog Waveform Generation Function, CMOS, CDIP14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| ICM7556MJD/C | ICM7556MJD/883B | ICM7556MJD/HR | ICM7555MTV/HR | ICM7555MTV/883B | ICM7555MTY | ICM7556MJD | ICM7555CBA-T | ICM7555IBA | ICM7555IBAT | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Analog Waveform Generation Function, CMOS, CDIP14 | Analog Waveform Generation Function, CMOS, CDIP14, | Analog Waveform Generation Function, CMOS, CDIP14 | Analog Waveform Generation Function, CMOS, MBCY8 | Analog Waveform Generation Function, CMOS, MBCY8, | Analog Waveform Generation Function, CMOS, MBCY8 | Analog Waveform Generation Function, CMOS, CDIP14, | Analog Waveform Generation Function, CMOS, PDSO8, | Analog Waveform Generation Function, CMOS, PDSO8, | Analog Waveform Generation Function, CMOS, PDSO8, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | DIP, DIP14,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | R-XDIP-T14 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 8 | 8 | 8 | 14 | 8 | 8 | 8 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -20 °C | -20 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | METAL | METAL | METAL | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | CAN8,.2 | CAN8,.2 | CAN8,.2 | DIP14,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | ROUND | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5 V | 5/15 V | 5 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE | WIRE | WIRE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| Terminal location | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL |
| encapsulated code | DIP | DIP | DIP | - | - | - | DIP | SOP | SOP | SOP |
| surface mount | NO | NO | NO | - | - | - | NO | YES | YES | YES |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | - | - | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Maker | - | - | - | - | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State |
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