ICM7555IBA datasheet, PDF - EEWORLD Datasheet

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ICM7555IBA: DescriptionAnalog Waveform Generation Function, CMOS, PDSO8,; CategoryAnalog mixed-signal IC The signal circuit; File Size461KB，8 Pages; ManufacturerGeneral Electric Solid State

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ICM7555IBA Overview

Analog Waveform Generation Function, CMOS, PDSO8,

ICM7555IBA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	General Electric Solid State
package instruction	SOP, SOP8,.25
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G8
JESD-609 code	e0
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	5/15 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL

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ICM7555IBA Related Products

	ICM7555IBA	ICM7556MJD/883B	ICM7556MJD/C	ICM7556MJD/HR	ICM7555MTV/HR	ICM7555MTV/883B	ICM7555MTY	ICM7556MJD	ICM7555CBA-T	ICM7555IBAT
Description	Analog Waveform Generation Function, CMOS, PDSO8,	Analog Waveform Generation Function, CMOS, CDIP14,	Analog Waveform Generation Function, CMOS, CDIP14	Analog Waveform Generation Function, CMOS, CDIP14	Analog Waveform Generation Function, CMOS, MBCY8	Analog Waveform Generation Function, CMOS, MBCY8,	Analog Waveform Generation Function, CMOS, MBCY8	Analog Waveform Generation Function, CMOS, CDIP14,	Analog Waveform Generation Function, CMOS, PDSO8,	Analog Waveform Generation Function, CMOS, PDSO8,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	SOP, SOP8,.25	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	, CAN8,.2	, CAN8,.2	, CAN8,.2	DIP, DIP14,.3	SOP, SOP8,.25	SOP, SOP8,.25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G8	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	O-MBCY-W8	O-MBCY-W8	O-MBCY-W8	R-XDIP-T14	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	8	14	14	14	8	8	8	14	8	8
Maximum operating temperature	85 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	85 °C
Minimum operating temperature	-20 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-20 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	METAL	METAL	METAL	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	SOP8,.25	DIP14,.3	DIP14,.3	DIP14,.3	CAN8,.2	CAN8,.2	CAN8,.2	DIP14,.3	SOP8,.25	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	ROUND	ROUND	ROUND	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	CYLINDRICAL	CYLINDRICAL	CYLINDRICAL	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5 V	5/15 V	5 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	WIRE	WIRE	WIRE	THROUGH-HOLE	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL	DUAL
Maker	General Electric Solid State	-	-	-	-	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State	General Electric Solid State
encapsulated code	SOP	DIP	DIP	DIP	-	-	-	DIP	SOP	SOP
surface mount	YES	NO	NO	NO	-	-	-	NO	YES	YES
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	-	-	-	2.54 mm	1.27 mm	1.27 mm

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