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PESD5V0S1BLD

Description
130W, BIDIRECTIONAL, SILICON, TVS DIODE, 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size2MB,4 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

PESD5V0S1BLD Overview

130W, BIDIRECTIONAL, SILICON, TVS DIODE, 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2

PESD5V0S1BLD Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeDFN
package instruction1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Maximum breakdown voltage9.5 V
Minimum breakdown voltage5.5 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PDSO-N2
JESD-609 codee3
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation130 W
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityBIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage5 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperature30
Base Number Matches1
NXP SOD882D package
with reduced height and
innovative pad design
First leadless package with tin-plated,
solderable side pads
This`new,`ultra-small`leadless`plastic`package`is`the`industry’s`first`to`offer`solderable`side`pads.``
It`measures`only`1.0`x`0.6`x`0.37`mm`and`delivers`very`high`mechanical`stability.
Key features
`
` Solderable`side`pads`
`
` Low`package`height`of`0.37`mm
`
` AEC-Q101`qualified
Key benefits
`
` `Supports`ultra-flat`PCB`designs
`
` `Side`pads`for`easy`visual`soldering`inspection`
`
` `High`shear`force`robustness
`
` `` ull`thermal,`electrical,`and`mounting`compatibility`with`
F
SOD882`and`competitor`offerings
`
` `Very`high`mechanical`stability
`
` `Minimized`package`tilting`
More information
`
` `http://www.nxp.com/infocus/topics/sod882d/
Key applications
`
` Highly`space-constrained`devices
`
` Mobile`phones
`
` Handheld`(consumer)`appliances
`
` Tablet`PCs

PESD5V0S1BLD Related Products

PESD5V0S1BLD PESD24VS1ULD
Description 130W, BIDIRECTIONAL, SILICON, TVS DIODE, 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2 150W, UNIDIRECTIONAL, SILICON, TVS DIODE, 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
Is it Rohs certified? conform to conform to
Parts packaging code DFN DFN
package instruction 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC PACKAGE-2
Contacts 2 2
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum breakdown voltage 9.5 V 27.5 V
Minimum breakdown voltage 5.5 V 26.5 V
Configuration SINGLE SINGLE
Diode component materials SILICON SILICON
Diode type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code R-PDSO-N2 R-PDSO-N2
JESD-609 code e3 e3
Humidity sensitivity level 1 1
Maximum non-repetitive peak reverse power dissipation 130 W 150 W
Number of components 1 1
Number of terminals 2 2
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260
polarity BIDIRECTIONAL UNIDIRECTIONAL
Certification status Not Qualified Not Qualified
Maximum repetitive peak reverse voltage 5 V 24 V
surface mount YES YES
technology AVALANCHE AVALANCHE
Terminal surface TIN TIN
Terminal form NO LEAD NO LEAD
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 30 30
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