MC10H105
Triple 2‐3‐2‐Input OR/NOR
Gate
Description
The MC10H105 is a triple 2-3-2-input OR/NOR gate. This
MECL 10H™ part is a functional/pinout duplication of the standard
MECL 10K™ family part, with 100% improvement in propagation
delay, and no increases in power-supply current.
Features
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•
Propagation Delay, 1.0 ns Typical
•
Power Dissipation 25 mW/Gate (same as MECL 10K)
•
Improved Noise Margin 150 mV
16
1
PDIP−16
P SUFFIX
CASE 648−08
20 1
PLLC−20
FN SUFFIX
CASE 775−02
(Over Operating Voltage and Temperature Range)
•
Voltage Compensated
•
MECL 10K Compatible
•
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
4
5
9
10
11
13
12
V
CC1
= Pin 1
V
CC2
= Pin 16
V
EE
= Pin 8
3
2
6
7
14
15
MARKING DIAGRAMS*
1 20
16
MC10H105P
AWLYYWWG
1
PDIP−16
A
WL, L
YY, Y
WW, W
G
10H105G
AWLYYWW
PLLC−20
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
Figure 1. Logic Diagram
*For additional marking information, refer to
Application Note
AND8002/D.
V
CC1
A
out
A
out
A
in
A
in
B
out
B
out
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
C
out
C
out
C
in
C
in
B
in
B
in
B
in
ORDERING INFORMATION
Device
MC10H105FNG
MC10H105PG
Package
PLLC−20
(Pb-Free)
PDIP−16
(Pb-Free)
Shipping
46 Units / Tube
25 Units / Tube
Pin assignment is for Dual-in-Line Package.
Figure 2. Pin Assignment
©
Semiconductor Components Industries, LLC, 2006
August, 2016
−
Rev. 8
1
Publication Order Number:
MC10H105/D
MC10H105
PACKAGE DIMENSIONS
20 LEAD PLLC
FN SUFFIX
CASE 775−02
ISSUE F
B
−N−
Y BRK
D
−L−
−M−
W
D
V
Z
0.007 (0.180)
U
M
T L-M
M
S
N
S
S
0.007 (0.180)
T L-M
N
S
20
1
X
VIEW D−D
G1
0.010 (0.250)
S
T L-M
S
N
S
A
Z
R
0.007 (0.180)
0.007 (0.180)
M
T L-M
T L-M
S
N
N
S
M
S
S
H
K1
0.007 (0.180)
M
T L-M
S
N
S
C
E
0.004 (0.100)
G
G1
0.010 (0.250)
S
T L-M
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L-M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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4
MC10H105
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
CASE 648−08
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10
°
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10
°
STYLE 2:
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
D
16
9
A
H
E1
E
1
NOTE 8
b2
TOP VIEW
8
B
A2
A
L
c
WITH LEADS CONSTRAINED
NOTE 5
END VIEW
e/2
NOTE 3
A1
D1
e
SIDE VIEW
16X
b
C
SEATING
PLANE
M
eB
END VIEW
0.010
M
C A
M
B
M
NOTE 6
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
MECL is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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5
MC10H105/D