MC10H103
Quad 2−Input OR Gate
Description
The MC10H103 is a quad 2−input OR gate. The MC10H103
provides one gate with OR/NOR outputs. This MECL 10H™ part is a
functional/pinout duplication of the standard MECL 10K™ family
part, with 100% improvement in propagation delay, and no increases
in power− supply current.
Features
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MARKING DIAGRAMS*
16
MC10H103L
AWLYYWW
CDIP−16
L SUFFIX
CASE 620A
1
•
Propagation Delay, 1.0 ns Typical
•
Power Dissipation 25 mW/Gate (same as MECL 10K)
•
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•
Voltage Compensated
•
MECL 10K Compatible
•
Pb−Free Packages are Available*
16
16
1
PDIP−16
P SUFFIX
CASE 648
1
MC10H103P
AWLYYWWG
10H103
ALYWG
SOEIAJ−16
CASE 966
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
10H103G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
February, 2006
−
Rev. 7
1
Publication Order Number:
MC10H103/D
MC10H103
V
CC1
2
3
15
9
14
V
CC1
= Pin 1
V
CC2
= Pin 16
V
EE
= Pin 8
A
out
B
out
A
in
A
in
B
in
B
in
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
C
out
D
out
C
in
C
in
D
in
D
in
C
out
4
5
6
7
12
13
10
11
Pin assignment is for Dual−in−Line Package.
Figure 1. Logic Diagram
Figure 2. Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Characteristic
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
Operating Temperature Range
Storage Temperature Range
Plastic
Ceramic
Continuous
Surge
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
0°
Symbol
I
E
I
inH
I
inL
V
OH
V
OL
V
IH
V
IL
Characteristic
Power Supply Current
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
−
−
0.5
−1.02
−1.95
−1.17
−1.95
Max
29
425
−
−0.84
−1.63
−0.84
−1.48
Min
−
−
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
26
265
−
−0.81
−1.63
−0.81
−1.48
Min
−
−
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
29
265
−
−0.735
−1.60
−0.735
−1.45
Unit
mA
mA
mA
Vdc
Vdc
Vdc
Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50
W
resistor to
−2.0
V.
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2
MC10H103
Table 3. AC CHARACTERISTICS
0°
Symbol
t
pd
t
r
t
f
Propagation Delay
Rise Time
Fall Time
Characteristic
Min
0.4
0.5
0.5
Max
1.3
1.7
1.7
Min
0.4
0.5
0.5
25°
Max
1.3
1.8
1.8
Min
0.45
0.5
0.5
75°
Max
1.45
1.9
1.9
Unit
ns
ns
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
Device
MC10H103M
MC10H103MG
MC10H103MEL
MC10H103MELG
MC10H103FN
MC10H103FNG
MC10H103FNR2
MC10H103FNR2G
MC10H103L
MC10H103P
MC10H103PG
Package
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
CDIP−16
PDIP−16
PDIP−16
(Pb−Free)
Shipping
†
50 Unit / Rail
50 Unit / Rail
2000 / Tape & Reel
2000 / Tape & Reel
46 Units / Rail
46 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
25 Unit / Rail
25 Unit / Rail
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H103
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
0.004 (0.100)
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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4
MC10H103
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
16
9
L
E
Q
1
E H
E
M
_
L
DETAIL P
1
8
Z
D
A
VIEW P
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A
1
b
c
D
E
e
H
E
L
L
E
M
Q
1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
_
0
_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
_
0
_
0.028
0.035
−−− 0.031
e
b
0.13 (0.005)
M
A
1
0.10 (0.004)
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
B
16
A
9
A
M
L
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
−−− 0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
−−−
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
16X
J
E
F
C
K
T
N
G
16X
0.25 (0.010)
M
T B
SEATING
PLANE
D
0.25 (0.010)
M
T A
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