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FEMC064GMFE6-D11-40

Description
Flash Card, 64GX8, PBGA169, FBGA-169
Categorystorage    storage   
File Size2MB,1 Pages
ManufacturerFlexxon Pte Ltd
Download Datasheet Parametric Compare View All

FEMC064GMFE6-D11-40 Overview

Flash Card, 64GX8, PBGA169, FBGA-169

FEMC064GMFE6-D11-40 Parametric

Parameter NameAttribute value
package instructionFBGA-169
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 codeR-PBGA-B169
memory density549755813888 bit
Memory IC TypeFLASH CARD
memory width8
Number of functions1
Number of terminals169
word count68719476736 words
character code64000000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64GX8
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Programming voltage2.7 V
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal locationBOTTOM
typeNAND TYPE
Base Number Matches1

FEMC064GMFE6-D11-40 Related Products

FEMC064GMFE6-D11-40 FEMC016GMFE6-D11-10 FEMC004GMFG5-D14-10 FEMC004GMFG5-D12-13
Description Flash Card, 64GX8, PBGA169, FBGA-169 Flash Card, 16GX8, PBGA169, FBGA-169 Flash Card, 4GX8, PBGA153, FBGA-153 Flash Card, 4GX8, PBGA169, FBGA-169
package instruction FBGA-169 FBGA-169 FBGA-153 FBGA-169
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-PBGA-B169 R-PBGA-B169 R-PBGA-B153 R-PBGA-B169
memory density 549755813888 bit 137438953472 bit 34359738368 bit 34359738368 bit
Memory IC Type FLASH CARD FLASH CARD FLASH CARD FLASH CARD
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 169 169 153 169
word count 68719476736 words 17179869184 words 4294967296 words 4294967296 words
character code 64000000000 16000000000 4000000000 4000000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -25 °C -25 °C
organize 64GX8 16GX8 4GX8 4GX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL OTHER OTHER
Terminal form BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
type NAND TYPE NAND TYPE NAND TYPE NAND TYPE
Base Number Matches 1 1 1 1
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