Flash Card, 16GX8, PBGA169, FBGA-169
| Parameter Name | Attribute value |
| package instruction | FBGA-169 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-PBGA-B169 |
| memory density | 137438953472 bit |
| Memory IC Type | FLASH CARD |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 169 |
| word count | 17179869184 words |
| character code | 16000000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 16GX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Programming voltage | 2.7 V |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal location | BOTTOM |
| type | NAND TYPE |
| Base Number Matches | 1 |
| FEMC016GMFE6-D11-10 | FEMC064GMFE6-D11-40 | FEMC004GMFG5-D14-10 | FEMC004GMFG5-D12-13 | |
|---|---|---|---|---|
| Description | Flash Card, 16GX8, PBGA169, FBGA-169 | Flash Card, 64GX8, PBGA169, FBGA-169 | Flash Card, 4GX8, PBGA153, FBGA-153 | Flash Card, 4GX8, PBGA169, FBGA-169 |
| package instruction | FBGA-169 | FBGA-169 | FBGA-153 | FBGA-169 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PBGA-B169 | R-PBGA-B169 | R-PBGA-B153 | R-PBGA-B169 |
| memory density | 137438953472 bit | 549755813888 bit | 34359738368 bit | 34359738368 bit |
| Memory IC Type | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 169 | 169 | 153 | 169 |
| word count | 17179869184 words | 68719476736 words | 4294967296 words | 4294967296 words |
| character code | 16000000000 | 64000000000 | 4000000000 | 4000000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -25 °C | -25 °C |
| organize | 16GX8 | 64GX8 | 4GX8 | 4GX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | BGA | BGA | BGA | BGA |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Programming voltage | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | OTHER | OTHER |
| Terminal form | BALL | BALL | BALL | BALL |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| type | NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE |
| Base Number Matches | 1 | 1 | 1 | 1 |
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