FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-29122-1E
Spread Spectrum Clock Generator
MB88162
■
DESCRIPTION
MB88162 is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary
radiation noise (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically with
the internal modulator.
■
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
Input frequency : 12 MHz to 28 MHz (Multiplied by 1), 20 MHz to 42 MHz (Multiplied by 4)
Multiplication rate : 1, 4
Output frequency : 12 MHz to 28 MHz (Multiplied by 1), 80 MHz to 168 MHz (Multiplied by 4)
Modulation rate : no modulation,
±
0.5%,
±
1.0%,
±
2.0%,
−
1.0%,
−
2.0%,
−
4.0% (The terminal can be selected.)
Equipped with oscillation circuit : Range of oscillation 12 MHz to 42 MHz
Built-in oscillation stabilization capacitance : 4 pF (Typ)
Modulation clock output Duty : 40% to 60%
Modulation clock Cycle-Cycle Jitter : Less than 100 ps
Low power consumption by CMOS process : 7.0 mA (24 MHz : no load, Typ-sample, Typ-condition)
Power supply voltage : 2.7 V to 3.6 V (Multiplied by 1), 3.0 V to 3.6 V (Multiplied by 4)
Operating temperature :
−
40
°C
to
+
85
°C
Package : BCC 18-pin
■
PACKAGE
18-pin plastic BCC
(
LCC
-
18P
-
M05
)
MB88162
■
PIN ASSIGNMENT
(TOP VIEW)
NC
NC
NC
NC
S0
V
SS
SPRD
OUT
S1
15 14 13 12 11 10
16
17
18
1
2
NC
3
NC
4
NC
5
NC
MB88162
9
8
7
6
OE
XOUT
XIN
V
DD
MLTP
■
PIN DESCRIPTION
Pin no.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Pin name
S1
NC
NC
NC
NC
MLTP
V
DD
XIN
XOUT
OE
NC
NC
NC
NC
S0
V
SS
SPRD
OUT
I/O
I
⎯
⎯
⎯
⎯
I
⎯
I
O
I
⎯
⎯
⎯
⎯
I
⎯
I
O
Description
Modulation rate setting pin (with pull-up resistance)
Non-connection pin (do not connect anything)
Non-connection pin (do not connect anything)
Non-connection pin (do not connect anything)
Non-connection pin (do not connect anything)
Multiplication rate setting pin (with pull-down resistance)
Power supply voltage pin
Resonator connection pin/clock input pin
Resonator connection pin
Clock output enable pin (with pull-up resistance)
Non-connection pin (do not connect anything)
Non-connection pin (do not connect anything)
Non-connection pin (do not connect anything)
Non-connection pin (do not connect anything)
Modulation rate setting pin (with pull-up resistance)
GND pin
Modulation type setting pin (with pull-up resistance)
Modulation clock output pin (OE= “L” Hi-Z output)
2
MB88162
■
I/O CIRCUIT TYPE
Pin
Circuit type
22 kΩ
OE signal
Remarks
• With pull-up resistor
The value of pull-up resistor is
switched by the input level of OE
signal.
800 kΩ at OE= “L” (Typ)
22 kΩ at OE= “H” (Typ)
• CMOS hysteresis input
OE
800 kΩ
Note : At OE=“L”
22kΩ Pull Up cut
50 kΩ
OE signal
S0,
S1,
SPRD
• With pull-up resistor 50 kΩ (Typ)
• CMOS hysteresis input
• Pull-up resistor is disconnected at
OE= “L”, and internal signal is fixed
to “L”.
Note : At OE=“L”
Pull Up cut
• With pull-down resistor 50 kΩ (Typ)
• CMOS hysteresis input
• Pull-down resistor is disconnected
at OE= “L”, and internal signal is
fixed to “L”.
MLTP
OE signal
50 kΩ
Note : At OE=“L”
Pull Down cut
OE signal
• CMOS output
• I
OL
= 8.0 mA
• Hi-Z output at OE
=
“L”
OUT
Note : At OE=“L”
Hi-Z output
(Continued)
3
MB88162
(Continued)
Pin
Circuit type
Remarks
• Oscillation circuit
• Built-in feedback resistance :
500 kΩ (Typ)
• Built-in oscillation stabilization
capacitance : 4 pF (Typ)
XIN
4 pF
XIN, XOUT
XOUT
500 kΩ
4 pF
4
MB88162
■
HANDLING DEVICES
Preventing Latch-up
A latch-up can occur if, on this device, (a) a voltage higher than power supply voltage or a voltage lower than
GND is applied to an input or output pin or (b) a voltage higher than the rating is applied between power supply
and GND. The latch-up, if it occurs, significantly increases the power supply current and may cause thermal
destruction of an element. When you use this device, be very careful not to exceed the maximum rating.
Handling unused pins
Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or
pull-down resistor.
Power supply pins
Please design connecting the power supply pin of this device by as low impedance as possible from the current
supply source.
We recommend connecting electrolytic capacitor (about 10
µF)
and the ceramic capacitor (about
0.01
µF)
in parallel between power supply and GND near the device, as a bypass capacitor.
Oscillation circuit
Noise near the XIN pin and XOUT pin may cause the device to malfunction. Design printed circuit boards so
that electric wiring of XIN pin or XOUT pin and the resonator do not intersect other wiring.
Design the printed circuit board that surrounds the XIN pin and XOUT pin with ground.
5
京公网安备 11010802033920号
EEWORLD
