|
LM3500TLX-21/NOPB |
LM3500TL-16/NOPB |
LM3500TL-21/NOPB |
LM3500TLX-16/NOPB |
| Description |
IC LED DISPLAY DRIVER, BGA8, MICRO, SMD-8, Display Driver |
IC LED DISPLAY DRIVER, BGA8, MICRO, SMD-8, Display Driver |
IC LED DISPLAY DRIVER, BGA8, MICRO, SMD-8, Display Driver |
IC LED DISPLAY DRIVER, BGA8, MICRO, SMD-8, Display Driver |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| package instruction |
VFBGA, |
VFBGA, |
VFBGA, |
VFBGA, |
| Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Interface integrated circuit type |
LED DISPLAY DRIVER |
LED DISPLAY DRIVER |
LED DISPLAY DRIVER |
LED DISPLAY DRIVER |
| JESD-30 code |
S-XBGA-B8 |
S-XBGA-B8 |
S-XBGA-B8 |
S-XBGA-B8 |
| JESD-609 code |
e1 |
e1 |
e1 |
e1 |
| length |
1.92 mm |
1.92 mm |
1.92 mm |
1.92 mm |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
| Multiplex display function |
NO |
NO |
NO |
NO |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of segments |
1 |
1 |
1 |
1 |
| Number of terminals |
8 |
8 |
8 |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-10 °C |
-10 °C |
-10 °C |
-10 °C |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
0.675 mm |
0.675 mm |
0.675 mm |
0.675 mm |
| Maximum supply voltage |
7 V |
7 V |
7 V |
7 V |
| Minimum supply voltage |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
| Nominal supply voltage |
3 V |
3 V |
3 V |
3 V |
| surface mount |
YES |
YES |
YES |
YES |
| Temperature level |
OTHER |
OTHER |
OTHER |
OTHER |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
| width |
1.92 mm |
1.92 mm |
1.92 mm |
1.92 mm |
| Maker |
- |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |