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UPD45128163G5-A75-9JF

Description
IC,SDRAM,4X2MX16,CMOS,TSOP,54PIN,PLASTIC
Categorystorage    storage   
File Size704KB,92 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

UPD45128163G5-A75-9JF Overview

IC,SDRAM,4X2MX16,CMOS,TSOP,54PIN,PLASTIC

UPD45128163G5-A75-9JF Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionTSOP, TSOP54,.46,32
Reach Compliance Codeunknown
Maximum access time5.4 ns
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PDSO-G54
JESD-609 codee0
memory density134217728 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of terminals54
word count8388608 words
character code8000000
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP
Encapsulate equivalent codeTSOP54,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Continuous burst length1,2,4,8,FP
Maximum standby current0.0005 A
Maximum slew rate0.23 mA
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Base Number Matches1
DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD45128441, 45128841, 45128163
128M-bit Synchronous DRAM
4-bank, LVTTL
Description
The
µ
PD45128441, 45128841, 45128163 are high-speed 134,217,728-bit synchronous dynamic random-access
memories, organized as 8,388,608
×
4
×
4, 4,194,304
×
8
×
4, 2,097,152
×
16
×
4 (word
×
bit
×
bank), respectively.
The synchronous DRAMs achieved high-speed data transfer using the pipeline architecture.
All inputs and outputs are synchronized with the positive edge of the clock.
The synchronous DRAMs are compatible with Low Voltage TTL (LVTTL).
These products are packaged in 54-pin TSOP (II).
Features
Fully Synchronous Dynamic RAM, with all signals referenced to a positive clock edge
Pulsed interface
Possible to assert random column address in every cycle
Quad internal banks controlled by BA0(A13) and BA1(A12)
Byte control (×16) by LDQM and UDQM
Programmable Wrap sequence (Sequential / Interleave)
Programmable burst length (1, 2, 4, 8 and full page)
Programmable /CAS latency (2 and 3)
Automatic precharge and controlled precharge
CBR (Auto) refresh and self refresh
• ×4, ×8, ×16
organization
Single 3.3 V
±
0.3 V power supply
LVTTL compatible inputs and outputs
4,096 refresh cycles / 64 ms
Burst termination by Burst stop command and Precharge command
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M12650EJAV0DS00 (10th edition)
Date Published January 2000 NS CP (K)
Printed in Japan
The mark
shows major revised points.
©
1997

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