MSM832GMB-020 datasheet, PDF - EEWORLD Datasheet

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MSM832GMB-020: DescriptionStandard SRAM, 32KX8, 20ns, CMOS, CDFP28; Categorystorage storage; File Size584KB，8 Pages; ManufacturerAPTA Group Inc

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MSM832GMB-020 Overview

Standard SRAM, 32KX8, 20ns, CMOS, CDFP28

MSM832GMB-020 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DFP, FL28,.4
Reach Compliance Code	unknown
Maximum access time	20 ns
I/O type	COMMON
JESD-30 code	R-XDFP-F28
JESD-609 code	e0
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL28,.4
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum standby current	0.001 A
Minimum standby current	4.5 V
Maximum slew rate	0.13 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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MSM832GMB-020 Related Products

	MSM832GMB-020	MSM832G-35	MSM832GMB-025	MSM832GI-025	MSM832GM-35	MSM832GI-020	MSM832GLM-35
Description	Standard SRAM, 32KX8, 20ns, CMOS, CDFP28	Standard SRAM, 32KX8, 35ns, CMOS, CDFP28	Standard SRAM, 32KX8, 25ns, CMOS, CDFP28	Standard SRAM, 32KX8, 25ns, CMOS, CDFP28	Standard SRAM, 32KX8, 35ns, CMOS, CDFP28	Standard SRAM, 32KX8, 20ns, CMOS, CDFP28	Standard SRAM, 32KX8, 35ns, CMOS, CDFP28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL28,.4	DFP, FL28,.4	DFP, FL28,.4	DFP, FL28,.4	DFP, FL28,.4	DFP, FL28,.4	DFP, FL28,.4
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow	unknow
Maximum access time	20 ns	35 ns	25 ns	25 ns	35 ns	20 ns	35 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDFP-F28	R-XDFP-F28	R-XDFP-F28	R-XDFP-F28	R-XDFP-F28	R-XDFP-F28	R-XDFP-F28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bi	262144 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8
Number of terminals	28	28	28	28	28	28	28
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	125 °C	85 °C	125 °C	85 °C	125 °C
Minimum operating temperature	-55 °C	-	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DFP	DFP	DFP	DFP	DFP	DFP
Encapsulate equivalent code	FL28,.4	FL28,.4	FL28,.4	FL28,.4	FL28,.4	FL28,.4	FL28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.001 A	0.002 A	0.001 A	0.001 A	0.002 A	0.001 A	0.00005 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	2 V
Maximum slew rate	0.13 mA	0.12 mA	0.13 mA	0.13 mA	0.12 mA	0.13 mA	0.12 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	-	-	APTA Group Inc	APTA Group Inc	APTA Group Inc	APTA Group Inc	APTA Group Inc

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