Standard SRAM, 32KX8, 35ns, CMOS, CDFP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | APTA Group Inc |
| package instruction | DFP, FL28,.4 |
| Reach Compliance Code | unknow |
| Maximum access time | 35 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDFP-F28 |
| JESD-609 code | e0 |
| memory density | 262144 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL28,.4 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.00005 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.12 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| MSM832GLM-35 | MSM832GMB-020 | MSM832G-35 | MSM832GMB-025 | MSM832GI-025 | MSM832GM-35 | MSM832GI-020 | |
|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 32KX8, 35ns, CMOS, CDFP28 | Standard SRAM, 32KX8, 20ns, CMOS, CDFP28 | Standard SRAM, 32KX8, 35ns, CMOS, CDFP28 | Standard SRAM, 32KX8, 25ns, CMOS, CDFP28 | Standard SRAM, 32KX8, 25ns, CMOS, CDFP28 | Standard SRAM, 32KX8, 35ns, CMOS, CDFP28 | Standard SRAM, 32KX8, 20ns, CMOS, CDFP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL28,.4 | DFP, FL28,.4 | DFP, FL28,.4 | DFP, FL28,.4 | DFP, FL28,.4 | DFP, FL28,.4 | DFP, FL28,.4 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknow |
| Maximum access time | 35 ns | 20 ns | 35 ns | 25 ns | 25 ns | 35 ns | 20 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 262144 bi | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 85 °C | 125 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | -55 °C | -40 °C | -55 °C | -40 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DFP | DFP | DFP | DFP | DFP | DFP |
| Encapsulate equivalent code | FL28,.4 | FL28,.4 | FL28,.4 | FL28,.4 | FL28,.4 | FL28,.4 | FL28,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.00005 A | 0.001 A | 0.002 A | 0.001 A | 0.001 A | 0.002 A | 0.001 A |
| Minimum standby current | 2 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.12 mA | 0.13 mA | 0.12 mA | 0.13 mA | 0.13 mA | 0.12 mA | 0.13 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | APTA Group Inc | - | - | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc |