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IS42VM16800G-75BLI-TR

Description
Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54
Categorystorage    storage   
File Size275KB,33 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance
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IS42VM16800G-75BLI-TR Overview

Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54

IS42VM16800G-75BLI-TR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codecompliant
Maximum access time6 ns
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeS-PBGA-B54
memory density134217728 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of terminals54
word count8388608 words
character code8000000
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA54,9X9,32
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
power supply1.8 V
Certification statusNot Qualified
refresh cycle4096
Continuous burst length1,2,4,8,FP
Maximum standby current0.00001 A
Maximum slew rate0.1 mA
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Base Number Matches1
IS42/45SM/RM/VM16800G
2M
x
16Bits
x
4Banks Mobile Synchronous DRAM
Description
These IS42/45SM/RM/VM16800G are mobile 134,217,728 bits CMOS Synchronous DRAM organized as 4 banks of 2,097,152 words x 16
bits. These products are offering fully synchronous operation and are referenced to a positive edge of the clock. All inputs and outputs
are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve high bandwidth. All input
and output voltage levels are compatible with LVCMOS.
Features
JEDEC standard 3.3V, 2.5V, 1.8V power supply
• Auto refresh and self refresh
• All pins are compatible with LVCMOS interface
• 4K refresh cycle / 64ms
• Programmable Burst Length and Burst Type
1, 2, 4, 8 or Full Page for Sequential Burst
4 or 8 for Interleave Burst
• Programmable CAS Latency : 2,3 clocks
• All inputs and outputs referenced to the positive edge of the
system clock
• Data mask function by DQM
• Internal 4 banks operation
• Burst Read Single Write operation
• Special Function Support
PASR(Partial Array Self Refresh)
Auto TCSR(Temperature Compensated Self Refresh)
Programmable Driver Strength Control
Full Strength or 1/2, 1/4, 1/8 of Full Strength
Deep Power Down Mode
• Automatic precharge, includes CONCURRENT Auto Precharge
Mode and controlled Precharge
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Rev. A | Apr. 2012
www.issi.com
- DRAM@issi.com
1

IS42VM16800G-75BLI-TR Related Products

IS42VM16800G-75BLI-TR IS42VM16800G-75BLI IS42RM16800G-75BLI IS42RM16800G-75BLI-TR
Description Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54 Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, TFBGA-54 Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, TFBGA-54 Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54
Is it Rohs certified? conform to conform to conform to conform to
Reach Compliance Code compliant compliant compliant compliant
Maximum access time 6 ns 6 ns 6 ns 6 ns
Maximum clock frequency (fCLK) 133 MHz 133 MHz 133 MHz 133 MHz
I/O type COMMON COMMON COMMON COMMON
interleaved burst length 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 code S-PBGA-B54 S-PBGA-B54 S-PBGA-B54 S-PBGA-B54
memory density 134217728 bit 134217728 bit 134217728 bit 134217728 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 16 16 16 16
Number of terminals 54 54 54 54
word count 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 8MX16 8MX16 8MX16 8MX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA TFBGA TFBGA FBGA
Encapsulate equivalent code BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY GRID ARRAY GRID ARRAY, FINE PITCH
power supply 1.8 V 1.8 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096 4096
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
Maximum standby current 0.00001 A 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA 0.1 mA
Nominal supply voltage (Vsup) 1.8 V 3.3 V 3.3 V 2.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
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