M58WR064B100ZB6T datasheet, PDF

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M58WR064B100ZB6T: Description64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory; Categorystorage storage; File Size22KB，1 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M58WR064B100ZB6T Overview

64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory

M58WR064B100ZB6T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56
Contacts	56
Reach Compliance Code	_compli
ECCN code	3A991.B.1.A
Maximum access time	100 ns
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B56
JESD-609 code	e0
length	9 mm
memory density	67108864 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,127
Number of terminals	56
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA56,7X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size	4 words
Parallel/Serial	PARALLEL
power supply	1.8/2,1.8/3 V
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1 mm
Department size	4K,32K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	2.2 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
switch bit	NO
type	NOR TYPE
width	7.7 mm

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Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible	-
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	-
Parts packaging code	BGA	BGA	BGA	BGA	-	BGA	BGA	-
package instruction	7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56	7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56	7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56	7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56	-	7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56	7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56	-
Contacts	56	56	56	56	-	56	56	-
Reach Compliance Code	_compli	_compli	_compli	_compli	-	_compli	_compli	-
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A	-
Maximum access time	100 ns	85 ns	100 ns	70 ns	-	85 ns	70 ns	-
startup block	BOTTOM	TOP	TOP	TOP	-	BOTTOM	BOTTOM	-
command user interface	YES	YES	YES	YES	-	YES	YES	-
Universal Flash Interface	YES	YES	YES	YES	-	YES	YES	-
Data polling	NO	NO	NO	NO	-	NO	NO	-
JESD-30 code	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	-	R-PBGA-B56	R-PBGA-B56	-
JESD-609 code	e0	e0	e0	e0	-	e0	e0	-
length	9 mm	9 mm	9 mm	9 mm	-	9 mm	9 mm	-
memory density	67108864 bi	67108864 bi	67108864 bi	67108864 bi	-	67108864 bi	67108864 bi	-
Memory IC Type	FLASH	FLASH	FLASH	FLASH	-	FLASH	FLASH	-
memory width	16	16	16	16	-	16	16	-
Number of functions	1	1	1	1	-	1	1	-
Number of departments/size	8,127	8,127	8,127	8,127	-	8,127	8,127	-
Number of terminals	56	56	56	56	-	56	56	-
word count	4194304 words	4194304 words	4194304 words	4194304 words	-	4194304 words	4194304 words	-
character code	4000000	4000000	4000000	4000000	-	4000000	4000000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	-	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-
organize	4MX16	4MX16	4MX16	4MX16	-	4MX16	4MX16	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA	-	VFBGA	VFBGA	-
Encapsulate equivalent code	BGA56,7X8,30	BGA56,7X8,30	BGA56,7X8,30	BGA56,7X8,30	-	BGA56,7X8,30	BGA56,7X8,30	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-
page size	4 words	4 words	4 words	4 words	-	4 words	4 words	-
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	-
power supply	1.8/2,1.8/3 V	1.8/2,1.8/3 V	1.8/2,1.8/3 V	1.8/2,1.8/3 V	-	1.8/2,1.8/3 V	1.8/2,1.8/3 V	-
Programming voltage	1.8 V	1.8 V	1.8 V	1.8 V	-	1.8 V	1.8 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-
Maximum seat height	1 mm	1 mm	1 mm	1 mm	-	1 mm	1 mm	-
Department size	4K,32K	4K,32K	4K,32K	4K,32K	-	4K,32K	4K,32K	-
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	-	0.000005 A	0.000005 A	-
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	-	0.03 mA	0.03 mA	-
Maximum supply voltage (Vsup)	2.2 V	2.2 V	2.2 V	2.2 V	-	2.2 V	2.2 V	-
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.7 V	-	1.65 V	1.7 V	-
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	-	1.8 V	1.8 V	-
surface mount	YES	YES	YES	YES	-	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	-	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	-
Terminal form	BALL	BALL	BALL	BALL	-	BALL	BALL	-
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm	-	0.75 mm	0.75 mm	-
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	-
switch bit	NO	NO	NO	NO	-	NO	NO	-
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-	NOR TYPE	NOR TYPE	-
width	7.7 mm	7.7 mm	7.7 mm	7.7 mm	-	7.7 mm	7.7 mm	-

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