64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory
| M58WR064T | M58WR064T85ZB6T | M58WR064T100ZB6T | M58WR064T70ZB6T | M58WR064B85ZB6T | M58WR064B100ZB6T | M58WR064B70ZB6T | M58WR064B | |
|---|---|---|---|---|---|---|---|---|
| Description | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory | 64 Mbit (4Mb x 16, Multiple Bank, Burst ) 1.8V Supply Flash Memory |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| Maker | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | - |
| Parts packaging code | - | BGA | BGA | BGA | BGA | BGA | BGA | - |
| package instruction | - | 7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56 | 7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56 | 7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56 | 7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56 | 7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56 | 7.70 X 9 MM, 0.75 MM PITCH, VFBGA-56 | - |
| Contacts | - | 56 | 56 | 56 | 56 | 56 | 56 | - |
| Reach Compliance Code | - | _compli | _compli | _compli | _compli | _compli | _compli | - |
| ECCN code | - | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | - |
| Maximum access time | - | 85 ns | 100 ns | 70 ns | 85 ns | 100 ns | 70 ns | - |
| startup block | - | TOP | TOP | TOP | BOTTOM | BOTTOM | BOTTOM | - |
| command user interface | - | YES | YES | YES | YES | YES | YES | - |
| Universal Flash Interface | - | YES | YES | YES | YES | YES | YES | - |
| Data polling | - | NO | NO | NO | NO | NO | NO | - |
| JESD-30 code | - | R-PBGA-B56 | R-PBGA-B56 | R-PBGA-B56 | R-PBGA-B56 | R-PBGA-B56 | R-PBGA-B56 | - |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 | - |
| length | - | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | 9 mm | - |
| memory density | - | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi | 67108864 bi | - |
| Memory IC Type | - | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | - |
| memory width | - | 16 | 16 | 16 | 16 | 16 | 16 | - |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
| Number of departments/size | - | 8,127 | 8,127 | 8,127 | 8,127 | 8,127 | 8,127 | - |
| Number of terminals | - | 56 | 56 | 56 | 56 | 56 | 56 | - |
| word count | - | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | - |
| character code | - | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | - |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| organize | - | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | - |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | - | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | - |
| Encapsulate equivalent code | - | BGA56,7X8,30 | BGA56,7X8,30 | BGA56,7X8,30 | BGA56,7X8,30 | BGA56,7X8,30 | BGA56,7X8,30 | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
| page size | - | 4 words | 4 words | 4 words | 4 words | 4 words | 4 words | - |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| power supply | - | 1.8/2,1.8/3 V | 1.8/2,1.8/3 V | 1.8/2,1.8/3 V | 1.8/2,1.8/3 V | 1.8/2,1.8/3 V | 1.8/2,1.8/3 V | - |
| Programming voltage | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | - | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | - |
| Department size | - | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K | - |
| Maximum standby current | - | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | - |
| Maximum slew rate | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | - |
| Maximum supply voltage (Vsup) | - | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | - |
| Minimum supply voltage (Vsup) | - | 1.65 V | 1.65 V | 1.7 V | 1.65 V | 1.65 V | 1.7 V | - |
| Nominal supply voltage (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| surface mount | - | YES | YES | YES | YES | YES | YES | - |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| Temperature level | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| Terminal surface | - | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | - |
| Terminal form | - | BALL | BALL | BALL | BALL | BALL | BALL | - |
| Terminal pitch | - | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm | - |
| Terminal location | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| switch bit | - | NO | NO | NO | NO | NO | NO | - |
| type | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - |
| width | - | 7.7 mm | 7.7 mm | 7.7 mm | 7.7 mm | 7.7 mm | 7.7 mm | - |