HD6433061XXXF datasheet, PDF - EEWORLD Datasheet

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HD6433061XXXF: Description16-BIT, MROM, 20MHz, MICROCONTROLLER, PQFP100, QFP-100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，1021 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD6433061XXXF Overview

16-BIT, MROM, 20MHz, MICROCONTROLLER, PQFP100, QFP-100

HD6433061XXXF Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	FQFP,
Contacts	100
Reach Compliance Code	compliant
Has ADC	YES
Other features	ALSO OPERATES AT 2.7V MINIMUM SUPPLY
Address bus width	24
bit size	16
maximum clock frequency	20 MHz
DAC channel	YES
DMA channel	NO
External data bus width	16
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
Number of I/O lines	79
Number of terminals	100
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	FQFP
Package shape	SQUARE
Package form	FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
rom(word)	98304
ROM programmability	MROM
Maximum seat height	3.05 mm
speed	20 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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REJ09B0215-0600

The revision list can be viewed directly by

clicking the title page.

The revision list summarizes the locations of

revisions and additions. Details should always

be checked by referring to the relevant text.

16

H8/3062, H8/3062B

Group

Hardware Manual

Renesas 16-Bit Single-Chip Microcomputer

H8 Family/H8/300H Series

H8/3062

HD6433062,

HD6433061,

HD6433060

H8/3062B HD6433064B,

HD6433062B,

HD6433061B,

HD6433060B

H8/3062F HD64F3062R,

HD64F3062B

H8/3064F HD64F3064B

Rev. 6.00

Revision Date: Mar 18, 2005

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and

more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corp. product best suited to the customer's application; they do not convey any license

under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or

a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-

party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corp. without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or

an authorized Renesas Technology Corp. product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising

from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various means,

including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data,

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total

system before making a final decision on the applicability of the information and products. Renesas

Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or

system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when

considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must

be exported under a license from the Japanese government and cannot be imported into a country

other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products

contained therein.

Rev. 6.00 Mar 18, 2005 page ii of xlviii

Preface

The H8/3062 Group is a high-performance single-chip microcomputer that integrates peripheral

functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal

architecture as its core.

The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable

timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI),

a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a

microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and

masked ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to

changing application specifications and the demands of the transition from initial to full-fledged

volume production.

Note: * F-ZTAT is a trademark of Renesas Technology Corp.

Intended Readership: This manual is intended for users undertaking the design of an application

system using the H8/3062 Group. Readers using this manual require a basic

knowledge of electrical circuits, logic circuits, and microcomputers.

Purpose:

The purpose of this manual is to give users an understanding of the hardware

functions and electrical characteristics of the H8/3062 Group. Details of

execution instructions can be found in the H8/300H Series Programming

Manual, which should be read in conjunction with the present manual.

Using this Manual:

•

For an overall understanding of the H8/3062 Group's functions

Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system

control functions, peripheral functions, and electrical characteristics.

•

For a detailed understanding of CPU functions

Refer to the separate publication H8/300H Series Programming Manual.

Note on bit notation: Bits are shown in high-to-low order from left to right.

Related Material:

The latest information is available at our web site. Please make sure that you

have the most up-to-date information available.

http://www.renesas.com/eng/

Rev. 6.00 Mar 18, 2005 page v of xlviii

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