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Datasheet> All Categories > storage> storage> HN28F4001P-20
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HN28F4001P-20

Description
Flash, 512KX8, 200ns, PDIP32, PLASTIC, DIP-32
Categorystorage    storage   
File Size438KB，18 Pages
ManufacturerHitachi （Renesas ）
Websitehttp://www.renesas.com/eng/
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HN28F4001P-20 Overview

Flash, 512KX8, 200ns, PDIP32, PLASTIC, DIP-32

HN28F4001P-20 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
command user interfaceNO
Data pollingYES
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.9 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size32
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Department size16K
Maximum standby current0.00002 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
width15.24 mm
Base Number Matches1

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Description Flash, 512KX8, 200ns, PDIP32, PLASTIC, DIP-32 Flash, 512KX8, 150ns, PDSO32, PLASTIC, TSOP1-32 Flash, 512KX8, 150ns, PDSO32, PLASTIC, SOP-32 Flash, 512KX8, 120ns, PDSO32, PLASTIC, SOP-32 Flash, 512KX8, 120ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 Flash, 512KX8, 200ns, PDSO32, PLASTIC, SOP-32 Flash, 512KX8, 150ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 Flash, 512KX8, 200ns, PDSO32, PLASTIC, TSOP1-32 Flash, 512KX8, 200ns, PDSO32, PLASTIC, REVERSE, TSOP1-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP TSOP1 SOIC SOIC TSOP1 SOIC TSOP1 TSOP1 TSOP1
package instruction DIP, DIP32,.6 PLASTIC, TSOP1-32 PLASTIC, SOP-32 PLASTIC, SOP-32 PLASTIC, REVERSE, TSOP1-32 SOP, SOP32,.56 PLASTIC, REVERSE, TSOP1-32 PLASTIC, TSOP1-32 PLASTIC, REVERSE, TSOP1-32
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 150 ns 150 ns 120 ns 120 ns 200 ns 150 ns 200 ns 200 ns
command user interface NO NO NO NO NO NO NO NO NO
Data polling YES YES YES YES YES YES YES YES YES
JESD-30 code R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 41.9 mm 18.4 mm 20.45 mm 20.45 mm 18.4 mm 20.45 mm 18.4 mm 18.4 mm 18.4 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of departments/size 32 32 32 32 32 32 32 32 32
Number of terminals 32 32 32 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSOP1 SOP SOP TSOP1-R SOP TSOP1-R LSSOP TSOP1-R
Encapsulate equivalent code DIP32,.6 TSSOP32,.8,20 SOP32,.56 SOP32,.56 TSSOP32,.8,20 SOP32,.56 TSSOP32,.8,20 TSSOP32,.8,20 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 1.2 mm 3.05 mm 3.05 mm 1.2 mm 3.05 mm 1.2 mm 1.27 mm 1.2 mm
Department size 16K 16K 16K 16K 16K 16K 16K 16K 16K
Maximum standby current 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA 0.1 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm 1.27 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit NO NO NO NO NO NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 15.24 mm 8 mm - - 8 mm - 8 mm 8 mm 8 mm
Maker - Hitachi （Renesas ） - Hitachi （Renesas ） Hitachi （Renesas ） Hitachi （Renesas ） Hitachi （Renesas ） Hitachi （Renesas ） Hitachi （Renesas ）
Other features - BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE - BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE - -

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