NHPXA270C0C312 datasheet, PDF - EEWORLD Datasheet

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NHPXA270C0C312: DescriptionRISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360; CategoryThe embedded processor and controller Microcontrollers and processors; File Size89KB，4 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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NHPXA270C0C312 Overview

RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360

NHPXA270C0C312 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	BGA,
Contacts	360
Reach Compliance Code	compliant
Address bus width	26
boundary scan	YES
maximum clock frequency	13.002 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B360
JESD-609 code	e1
length	23 mm
low power mode	YES
Number of terminals	360
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	2.59 mm
speed	312 MHz
Maximum supply voltage	1.705 V
Minimum supply voltage	1.1875 V
Nominal supply voltage	1.25 V
surface mount	YES
technology	CMOS
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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Product Brief

Intel

PXA270 Development

Platform:

Portable Media Player

Intel

PXA270 Development Platform:

Portable Media Player

Pictures, music and video are all quickly making

the transition to digital formats. Consumers

now have the ability to do things that were

once only dreamed of—sharing digital pic-

tures across the globe, digitally recording

a TV show and watching it on a portable

device, downloading a movie off the Web,

creating audio mixes in minutes, and many

more functions are possible today.

The Intel

PXA270 Development Platform:

Portable Media Player

is a platform that lever-

ages the outstanding capabilities of Intel XScale

technology based processors, providing a complete hardware and software

package, to enable faster time to market.

This new platform combines industry standard tools such as JTAG debug-

ging, Intel debugging tools, Microsoft Platform Builder*, and a wide array

of peripheral support in a single robust development platform. A broad

commitment from Microsoft* for software and board support packages

for both Microsoft Windows Mobile* 5.0 and Linux* make the Intel PXA270

Development Platform:

Portable Media Player

an ideal solution for the most

popular digital applications today.

Built on the foundation of Intel XScale

Technology

Designed to optimize low power consumption and high performance processing, the Intel PXA270

Development Platform:

Portable Media Player

is based on Intel XScale

microarchitecture with Intel

Wireless MMX

™

technology. Intel XScale technology based processors deliver advanced integration,

leading multimedia performance and superior power savings across a wide range of applications and

rich services for handheld devices.

The Intel PXA270 Development Platform:

Portable Media Player

takes advantage of some of the most

advanced features developed on the Intel XScale technology based platforms:

•

Wireless Intel SpeedStep

Power Manager

delivers the ability to dynamically adjust the

frequency and voltage of the processor for advanced power savings.

•

Intel

Wireless Trusted Platform

provides fundamental security building blocks in hardware and

software to protect content and secure user information.

•

Intel

VTune

™

Performance Analyzer

locates and removes performance bottlenecks.

•

Intel

Integrated Performance Primitives (Intel

IPP)

are cross-platform libraries that increase

application performance and functionality while speeding development.

•

Intel

Thread Compiler

implements various optimization techniques including scheduling, support

for double load and store, interprocedural optimization, and more.

NHPXA270C0C312 Related Products

	NHPXA270C0C312	NHPXA270C0E312	NHPXA270C0C416	RTPXA270C0C624	RTPXA270C0C416	RTPXA270C0C312	RTPXA270C0C520	NHPXA270C0C520
Description	RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	SOC PXA270 356-Pin VFBGA	RISC Microprocessor, 32-Bit, 416MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 32-Bit, 312MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 32-Bit, 520MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 520MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360
Is it Rohs certified?	conform to	conform to	conform to	-	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	-	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	-	VFBGA, BGA356,24X24,20	VFBGA, BGA356,24X24,20	VFBGA, BGA356,24X24,20	BGA,
Contacts	360	360	360	-	356	356	356	360
Reach Compliance Code	compliant	compliant	compliant	-	compliant	compliant	compliant	compliant
Address bus width	26	26	26	-	26	26	26	26
boundary scan	YES	YES	YES	-	YES	YES	YES	YES
maximum clock frequency	13.002 MHz	13.002 MHz	13.002 MHz	-	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz
External data bus width	32	32	32	-	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	-	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	-	YES	YES	YES	YES
JESD-30 code	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360	-	S-PBGA-B356	S-PBGA-B356	S-PBGA-B356	S-PBGA-B360
JESD-609 code	e1	e1	e1	-	e1	e1	e1	e1
length	23 mm	23 mm	23 mm	-	13 mm	13 mm	13 mm	23 mm
low power mode	YES	YES	YES	-	YES	YES	YES	YES
Number of terminals	360	360	360	-	356	356	356	360
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	-	VFBGA	VFBGA	VFBGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	260	-	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.59 mm	2.59 mm	2.59 mm	-	1 mm	1 mm	1 mm	2.59 mm
speed	312 MHz	312 MHz	416 MHz	-	416 MHz	312 MHz	520 MHz	520 MHz
Maximum supply voltage	1.705 V	1.705 V	1.705 V	-	1.705 V	1.705 V	1.705 V	1.705 V
Minimum supply voltage	1.1875 V	1.1875 V	1.2825 V	-	1.2825 V	1.1875 V	1.3775 V	1.3775 V
Nominal supply voltage	1.25 V	1.25 V	1.35 V	-	1.35 V	1.25 V	1.45 V	1.45 V
surface mount	YES	YES	YES	-	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	-	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	-	0.5 mm	0.5 mm	0.5 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	-	40	40	40	40
width	23 mm	23 mm	23 mm	-	13 mm	13 mm	13 mm	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Maker	-	-	Intel	-	Intel	Intel	Intel	Intel

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