RTPXA270C0C624 datasheet, PDF - EEWORLD Datasheet

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RTPXA270C0C624: DescriptionSOC PXA270 356-Pin VFBGA; File Size89KB，4 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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RTPXA270C0C624 Overview

SOC PXA270 356-Pin VFBGA

RTPXA270C0C624 Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
HTS	8542.39.00.01
Family Name	PXA270
Maximum Clock Rate (MHz)	624
Program Memory Type	Flash
RAM Size	256KB
Type	System-On-Chip
Processing Unit	Microprocessor
PWM	4
Watchdog	1
Minimum Operating Temperature (°C)	-25
Maximum Operating Temperature (°C)	85
Interface Type	I2S/UART/USB
SPI	1
I2C	0
I2S	1
UART	3
USB	1
USART	0
CAN	0
Ethernet	0
Programmability	Yes
Supplier Package	VFBGA
Pin Count	356
Standard Package Name	BGA
Mounting	Surface Mount
Package Height	0.7(Max)
Package Length	13
Package Width	13
PCB changed	356
Lead Shape	Ball

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Product Brief

Intel

PXA270 Development

Platform:

Portable Media Player

Intel

PXA270 Development Platform:

Portable Media Player

Pictures, music and video are all quickly making

the transition to digital formats. Consumers

now have the ability to do things that were

once only dreamed of—sharing digital pic-

tures across the globe, digitally recording

a TV show and watching it on a portable

device, downloading a movie off the Web,

creating audio mixes in minutes, and many

more functions are possible today.

The Intel

PXA270 Development Platform:

Portable Media Player

is a platform that lever-

ages the outstanding capabilities of Intel XScale

technology based processors, providing a complete hardware and software

package, to enable faster time to market.

This new platform combines industry standard tools such as JTAG debug-

ging, Intel debugging tools, Microsoft Platform Builder*, and a wide array

of peripheral support in a single robust development platform. A broad

commitment from Microsoft* for software and board support packages

for both Microsoft Windows Mobile* 5.0 and Linux* make the Intel PXA270

Development Platform:

Portable Media Player

an ideal solution for the most

popular digital applications today.

Built on the foundation of Intel XScale

Technology

Designed to optimize low power consumption and high performance processing, the Intel PXA270

Development Platform:

Portable Media Player

is based on Intel XScale

microarchitecture with Intel

Wireless MMX

™

technology. Intel XScale technology based processors deliver advanced integration,

leading multimedia performance and superior power savings across a wide range of applications and

rich services for handheld devices.

The Intel PXA270 Development Platform:

Portable Media Player

takes advantage of some of the most

advanced features developed on the Intel XScale technology based platforms:

•

Wireless Intel SpeedStep

Power Manager

delivers the ability to dynamically adjust the

frequency and voltage of the processor for advanced power savings.

•

Intel

Wireless Trusted Platform

provides fundamental security building blocks in hardware and

software to protect content and secure user information.

•

Intel

VTune

™

Performance Analyzer

locates and removes performance bottlenecks.

•

Intel

Integrated Performance Primitives (Intel

IPP)

are cross-platform libraries that increase

application performance and functionality while speeding development.

•

Intel

Thread Compiler

implements various optimization techniques including scheduling, support

for double load and store, interprocedural optimization, and more.

RTPXA270C0C624 Related Products

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Description	SOC PXA270 356-Pin VFBGA	RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 32-Bit, 416MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 32-Bit, 312MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 32-Bit, 520MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 520MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	-	BGA,	BGA,	BGA,	VFBGA, BGA356,24X24,20	VFBGA, BGA356,24X24,20	VFBGA, BGA356,24X24,20	BGA,
Contacts	-	360	360	360	356	356	356	360
Reach Compliance Code	-	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Address bus width	-	26	26	26	26	26	26	26
boundary scan	-	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	-	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz
External data bus width	-	32	32	32	32	32	32	32
Format	-	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	-	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	-	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360	S-PBGA-B356	S-PBGA-B356	S-PBGA-B356	S-PBGA-B360
JESD-609 code	-	e1	e1	e1	e1	e1	e1	e1
length	-	23 mm	23 mm	23 mm	13 mm	13 mm	13 mm	23 mm
low power mode	-	YES	YES	YES	YES	YES	YES	YES
Number of terminals	-	360	360	360	356	356	356	360
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	BGA	BGA	BGA	VFBGA	VFBGA	VFBGA	BGA
Package shape	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY
Peak Reflow Temperature (Celsius)	-	260	260	260	260	260	260	260
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	2.59 mm	2.59 mm	2.59 mm	1 mm	1 mm	1 mm	2.59 mm
speed	-	312 MHz	312 MHz	416 MHz	416 MHz	312 MHz	520 MHz	520 MHz
Maximum supply voltage	-	1.705 V	1.705 V	1.705 V	1.705 V	1.705 V	1.705 V	1.705 V
Minimum supply voltage	-	1.1875 V	1.1875 V	1.2825 V	1.2825 V	1.1875 V	1.3775 V	1.3775 V
Nominal supply voltage	-	1.25 V	1.25 V	1.35 V	1.35 V	1.25 V	1.45 V	1.45 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	-	1 mm	1 mm	1 mm	0.5 mm	0.5 mm	0.5 mm	1 mm
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	-	40	40	40	40	40	40	40
width	-	23 mm	23 mm	23 mm	13 mm	13 mm	13 mm	23 mm
uPs/uCs/peripheral integrated circuit type	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Maker	-	-	-	Intel	Intel	Intel	Intel	Intel

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