Am29F040B
4 Megabit (512 K x 8-Bit)
CMOS 5.0 Volt-only, Uniform Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
5.0 V
±
10% for read and write operations
— Minimizes system level power requirements
s
Manufactured on 0.32 µm process technology
— Compatible with 0.5 µm Am29F040 device
s
High performance
— Access times as fast as 55 ns
s
Low power consumption
— 20 mA typical active read current
— 30 mA typical program/erase current
— 1 µA typical standby current (standard access
time to active mode)
s
Flexible sector architecture
— 8 uniform sectors of 64 Kbytes each
— Any combination of sectors can be erased
— Supports full chip erase
— Sector protection:
A hardware method of locking sectors to prevent
any program or erase operations within that sector
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies bytes at specified addresses
s
Minimum 1,000,000 program/erase cycles per
sector guaranteed
s
20-year data retention at 125°C
— Reliable operation for the life of the system
s
Package options
— 32-pin PLCC, TSOP, or PDIP
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply Flash standard
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends a sector erase operation to read data
from, or program data to, a non-erasing sector,
then resumes the erase operation
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication#
21445
Rev:
C
Amendment/+2
Issue Date:
May 17, 1999
GENERAL DESCRIPTION
The Am29F040B is a 4 Mbit, 5.0 volt-only Flash mem-
ory organized as 524,288 Kbytes of 8 bits each. The
512 Kbytes of data are divided into eight sectors of 64
Kbytes each for flexible erase capability. The 8 bits of
data appear on DQ0–DQ7. The Am29F040B is offered
in 32-pin PLCC, TSOP, and PDIP packages. This device
is designed to be programmed in-system with the stan-
dard system 5.0 volt VCC supply. A 12.0 volt VPP is not
required for write or erase operations. The device can
also be programmed in standard EPROM programmers.
This device is manufactured using AMD’s 0.32 µm pro-
cess technology, and offers all the features and
benefits of the Am29F040, which was manufactured
using 0.5 µm process technology. In addtion, the
Am29F040B has a second toggle bit, DQ2, and also of-
fers the ability to program in the Erase Suspend mode.
The standard Am29F040B offers access times of 55,
70, 90, 120, and 150 ns, allowing high-speed micropro-
cessors to operate without wait states. To eliminate bus
contention the device has separate chip enable (CE#),
write enable (WE#) and output enable (OE#) controls.
The device requires only a
single 5.0 volt power sup-
ply
for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard.
Com-
mands are written to the command register using
standard microprocessor write timings. Register con-
tents serve as input to an internal state-machine that
controls the erase and programming circuitry. Write cy-
cles also internally latch addresses and data needed
for the programming and erase operations. Reading
data out of the device is similar to reading from other
Flash or EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the
Embedded
Program
algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin.
Device erasure occurs by executing the erase com-
mand sequence. This initiates the
Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
The host system can detect whether a program or
erase operation is complete by reading the DQ7 (Data#
Polling) and DQ6 (toggle)
status bits.
After a program
or erase cycle has been completed, the device is ready
to read array data or accept another command.
The
sector erase architecture
allows memory sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection
measures include a low
V
CC
detector that automatically inhibits write opera-
tions during power transitions. The
hardware sector
protection
feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achieved via programming equipment.
The
Erase Suspend
feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The system can place the device into the
standby mode.
Power consumption is greatly reduced in this mode.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within a
sector simultaneously via Fowler-Nordheim tunneling.
The data is programmed using hot electron injection.
2
Am29F040B
PIN CONFIGURATION
A0–A18
=
Address Inputs
Data Input/Output
Chip Enable
Write Enable
Output Enable
Device Ground
DQ0–DQ7 =
CE#
WE#
OE#
V
SS
V
CC
=
=
=
=
LOGIC SYMBOL
19
A0–A18
DQ0–DQ7
CE#
OE#
WE#
8
= +5.0 V single power supply
(see Product Selector Guide for
device speed ratings and voltage
supply tolerances)
21445C-5
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed
by a combination of the following:
Am29F040B
-55
E
C
B
OPTIONAL PROCESSING
Blank = Standard Processing
B
= Burn-In
(Contact an AMD representative for more information)
TEMPERATURE RANGE
C
= Commercial (0°C to +70°C)
I
= Industrial (–40
°
C to +85
°
C)
E
= Extended (–55
°
C to +125
°
C)
PACKAGE TYPE
P
= 32-Pin Plastic DIP (PD 032)
J
= 32-Pin Rectangular Plastic Leaded Chip Carrier (PL 032)
E
= 32-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 032)
F
= 32-Pin Thin Small Outline Package (TSOP) Reverse Pinout (TSR032)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
Am29F040B
4 Megabit (512 K x 8-Bit) CMOS 5.0 Volt-only Sector Erase Flash Memory
5.0 V Read, Program, and Erase
Valid Combinations
AM29F040B-55
JC, JI, JE, EC, EI, EE, FC, FI, FE
AM29F040B-70
AM29F040B-90
AM29F040B-120
AM29F040B-150
PC, PI, PE,
JC, JI, JE,
EC, EI, EE,
FC, FI, FE
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Am29F040B
5
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