1135X8 APPLICATION SPECIFIC SRAM, 21ns, PDSO24, 0.450 INCH, PLASTIC, SOP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SOIC |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Maximum access time | 21 ns |
| JESD-30 code | R-PDSO-G24 |
| JESD-609 code | e0 |
| Memory IC Type | MEMORY CIRCUIT |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP24,.5 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.07 A |
| Maximum slew rate | 0.07 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| UPD42102G-2 | UPD42102G-5 | UPD42102C-2 | UPD42102G-3 | UPD42102C-1 | UPD42102C-3 | UPD42102G-1 | UPD42102C-5 | |
|---|---|---|---|---|---|---|---|---|
| Description | 1135X8 APPLICATION SPECIFIC SRAM, 21ns, PDSO24, 0.450 INCH, PLASTIC, SOP-24 | 1135X8 APPLICATION SPECIFIC SRAM, 18ns, PDSO24, 0.450 INCH, PLASTIC, SOP-24 | IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC | 1135X8 APPLICATION SPECIFIC SRAM, 21ns, PDSO24, 0.450 INCH, PLASTIC, SOP-24 | 1135X8 APPLICATION SPECIFIC SRAM, 40ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | IC,FIELD/FRAME/LINE MEMORY,CMOS,DIP,24PIN,PLASTIC | 1135X8 APPLICATION SPECIFIC SRAM, 40ns, PDSO24, 0.450 INCH, PLASTIC, SOP-24 | 1135X8 APPLICATION SPECIFIC SRAM, 18ns, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOIC | SOIC | DIP | SOIC | DIP | DIP | SOIC | DIP |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow | unknow | unknow |
| Maximum access time | 21 ns | 18 ns | 21 ns | 21 ns | 40 ns | 21 ns | 40 ns | 18 ns |
| JESD-30 code | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | DIP | SOP | DIP | DIP | SOP | DIP |
| Encapsulate equivalent code | SOP24,.5 | SOP24,.5 | DIP24,.3 | SOP24,.5 | DIP24,.3 | DIP24,.3 | SOP24,.5 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.07 A | 0.08 A | 0.07 A | 0.08 A | 0.04 A | 0.08 A | 0.04 A | 0.08 A |
| Maximum slew rate | 0.07 mA | 0.08 mA | 0.07 mA | 0.08 mA | 0.04 mA | 0.08 mA | 0.04 mA | 0.08 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | NO | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | - | - | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
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