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UPD44644365F5-E50-FQ1-A

Description
2MX36 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165
Categorystorage    storage   
File Size371KB,40 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance  
Download Datasheet Parametric View All

UPD44644365F5-E50-FQ1-A Overview

2MX36 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, LEAD FREE, PLASTIC, BGA-165

UPD44644365F5-E50-FQ1-A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time0.45 ns
Maximum clock frequency (fCLK)200 MHz
I/O typeSEPARATE
JESD-30 codeR-PBGA-B165
memory density75497472 bit
Memory IC TypeSTANDARD SRAM
memory width36
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply1.5/1.8,1.8 V
Certification statusNot Qualified
Minimum standby current1.7 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Base Number Matches1
PRELIMINARY DATA SHEET
MOS INTEGRATED CIRCUIT
μ
PD44644085, 44644095, 44644185, 44644365
72M-BIT DDR II SRAM SEPARATE I/O
2-WORD BURST OPERATION
Description
The
μ
PD44644085 is a 8,388,608-word by 8-bit, the
μ
PD44644095 is a 8,388,608-word by 9-bit, the
μ
PD44644185 is a
4,194,304-word by 18-bit and the
μ
PD44644365 is a 2,097,152-word by 36-bit synchronous double data rate static RAM
fabricated with advanced CMOS technology using full CMOS six-transistor memory cell.
The
μ
PD44644085,
μ
PD44644095,
μ
PD44644185 and
μ
PD44644365 integrate unique synchronous peripheral circuitry
and a burst counter. All input registers controlled by an input clock pair (K and K#) are latched on the positive edge of K
and K#.
These products are suitable for application which require synchronous operation, high speed, low voltage, high density
and wide bit configuration.
These products are packaged in 165-pin PLASTIC BGA.
Features
1.8
±
0.1 V power supply
165-pin PLASTIC BGA package (15 x 17)
HSTL interface
PLL circuitry for wide output data valid window and future frequency scaling
Separate independent read and write data ports
DDR read or write operation initiated each cycle
Pipelined double data rate operation
Separate data input/output bus
Two-tick burst for low DDR transaction size
Two input clocks (K and K#) for precise DDR timing at clock rising edges only
Two output clocks (C and C#) for precise flight time and clock skew matching-clock
and data delivered together to receiving device
Internally self-timed write control
Clock-stop capability. Normal operation is restored in 1,024 cycles after clock is resumed.
User programmable impedance output
Fast clock cycle time : 3.7 ns (270 MHz), 4.0 ns (250 MHz), 5.0 ns (200 MHz)
Simple control logic for easy depth expansion
JTAG boundary scan
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. M18230EJ2V0DS00 (2nd edition)
Date Published February 2007 NS CP(N)
Printed in Japan
The mark <R> shows major revised points.
2006
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.

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