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While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
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The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
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According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
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Have you ever heard stories about "crazy appliances"? Think of microwaves that turn on automatically or ovens that preheat without any human input? With radios and electromagnetic interfaces ubiqui...[Details]
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There are basically three causes of spontaneous combustion of electric vehicles: The first is that the battery components are punctured or suffer fatal damage due to a collision accident, and part ...[Details]
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"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
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On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
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New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
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Facial recognition, a biometric technology that uses facial features to authenticate identity, has rapidly become a global market hotspot in recent years as the technology has entered practical use...[Details]
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Renesas Electronics introduces a new USB-C power solution with an innovative three-level topology.
Improve performance while reducing system size
New solution combines excel...[Details]
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As the core of electric vehicles, batteries are concerned with vehicle use and maintenance. The operation of vehicles is guaranteed by the electricity generated by batteries. For batteries, battery...[Details]
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