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M29F100B-90XM6TR

Description
1 Mbit 128Kb x8 or 64Kb x16, Boot Block Single Supply Flash Memory
Categorystorage    storage   
File Size191KB,30 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

M29F100B-90XM6TR Overview

1 Mbit 128Kb x8 or 64Kb x16, Boot Block Single Supply Flash Memory

M29F100B-90XM6TR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeSOIC
package instruction0.525 INCH, PLASTIC, SO-44
Contacts44
Reach Compliance Code_compli
ECCN codeEAR99
Maximum access time90 ns
Other featuresCONFG AS 64K X 16; BOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length28.2 mm
memory density1048576 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,1,1
Number of terminals44
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP44,.63
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height2.62 mm
Department size16K,8K,32K,64K
Maximum standby current0.0001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width13.3 mm
M29F100T
M29F100B
1 Mbit (128Kb x8 or 64Kb x16, Boot Block)
Single Supply Flash Memory
5V
±
10% SUPPLY VOLTAGE for PROGRAM,
ERASE and READ OPERATIONS
FAST ACCESS TIME: 70ns
FAST PROGRAMMING TIME
– 10
µ
s by Byte / 16
µ
s by Word typical
PROGRAM/ERASE CONTROLLER (P/E.C.)
– Program Byte-by-Byte or Word-by-Word
– Status Register bits and Ready/Busy Output
MEMORY BLOCKS
– Boot Block (Top or Bottom location)
– Parameter and Main blocks
BLOCK, MULTI-BLOCK and CHIP ERASE
MULTI-BLOCK PROTECTION/TEMPORARY
UNPROTECTION MODES
ERASE SUSPEND and RESUME MODES
– Read and Program another Block during
Erase Suspend
LOW POWER CONSUMPTION
– Stand-by and Automatic Stand-by
100,000 PROGRAM/ERASE CYCLES per
BLOCK
20 YEARS DATA RETENTION
– Defectivity below 1ppm/year
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h
– Device Code, M29F100T: 00D0h
– Device Code, M29F100B: 00D1h
DESCRIPTION
The M29F100 is a non-volatile memory that may
be erased electrically at the block or chip level and
programmed in-system on a Byte-by-Byteor Word-
by-Word basis using only a single 5V V
CC
supply.
For Program and Erase operations the necessary
high voltages are generated internally. The device
can also be programmed in standard program-
mers.
The array matrix organisation allows each block to
be erased and reprogrammed without affecting
other blocks. Blocks can be protected against pro-
graming and erase on programming equipment,
and temporarily unprotected to make changes in
the application. Each block can be programmed
and erased over 100,000 cycles.
July 1998
44
1
TSOP48 (N)
12 x 20 mm
SO44 (M)
Figure 1. Logic Diagram
VCC
16
A0-A15
W
E
G
RP
M29F100T
M29F100B
15
DQ0-DQ14
DQ15A–1
BYTE
RB
VSS
AI01974
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