Basic information of TLV2450Y amplifier:
TLV2450Y is an OPERATIONAL AMPLIFIER. The commonly used packaging method is DIE
TLV2450Y amplifier core information:
The minimum operating temperature of the TLV2450Y is , and the maximum operating temperature is 70 °C. Maximum bias current at 25°C: 0.005 µA Maximum average bias current is 0.007 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the TLV2450Y has a nominal slew rate of 0.11 V/us. The maximum slew rate of the TLV2450Y given by the manufacturer is 0.035 mA, while the minimum slew rate is 0.02 V/us. Its minimum voltage gain is 35000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2450Y gain becomes 0.707 times the low-frequency gain is 220 kHz. The power of TLV2450Y is NO. Its programmable power is NO.
The nominal supply voltage of the TLV2450Y is 5 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2450Y is 2000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2450Y:
TLV2450Y has 6 terminals. Its terminal position type is: UPPER. Total pins: 6
TLV2450Y amplifier additional information:
TLV2450Y adopts the VOLTAGE-FEEDBACK architecture. It is not a low-bias amplifier. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2450Y is: YES. Its temperature grade is: COMMERCIAL.
It is a micropower amplifier. The corresponding JESD-30 code is: R-XUUC-N6. The package code of TLV2450Y is: DIE. The materials used in the TLV2450Y package are mostly UNSPECIFIED. The package shape is RECTANGULAR.
The TLV2450Y package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
Basic information of TLV2450Y amplifier:
TLV2450Y is an OPERATIONAL AMPLIFIER. The commonly used packaging method is DIE
TLV2450Y amplifier core information:
The minimum operating temperature of the TLV2450Y is , and the maximum operating temperature is 70 °C. Maximum bias current at 25°C: 0.005 µA Maximum average bias current is 0.007 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the TLV2450Y has a nominal slew rate of 0.11 V/us. The maximum slew rate of the TLV2450Y given by the manufacturer is 0.035 mA, while the minimum slew rate is 0.02 V/us. Its minimum voltage gain is 35000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2450Y gain becomes 0.707 times the low-frequency gain is 220 kHz. The power of TLV2450Y is NO. Its programmable power is NO.
The nominal supply voltage of the TLV2450Y is 5 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2450Y is 2000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2450Y:
TLV2450Y has 6 terminals. Its terminal position type is: UPPER. Total pins: 6
TLV2450Y amplifier additional information:
TLV2450Y adopts the VOLTAGE-FEEDBACK architecture. It is not a low-bias amplifier. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2450Y is: YES. Its temperature grade is: COMMERCIAL.
It is a micropower amplifier. The corresponding JESD-30 code is: R-XUUC-N6. The package code of TLV2450Y is: DIE. The materials used in the TLV2450Y package are mostly UNSPECIFIED. The package shape is RECTANGULAR.
The TLV2450Y package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
| Parameter Name | Attribute value |
| Parts packaging code | DIE |
| package instruction | DIE |
| Contacts | 6 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.007 µA |
| Maximum bias current (IIB) at 25C | 0.005 µA |
| Nominal Common Mode Rejection Ratio | 66 dB |
| frequency compensation | YES |
| Maximum input offset voltage | 2000 µV |
| JESD-30 code | R-XUUC-N6 |
| low-bias | NO |
| low-dissonance | NO |
| micropower | YES |
| Negative supply voltage upper limit | |
| Nominal Negative Supply Voltage (Vsup) | |
| Number of functions | 1 |
| Number of terminals | 6 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Encapsulate equivalent code | DIE OR CHIP |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| method of packing | TUBE |
| power | NO |
| power supply | +-1.35/+-3/2.7/6 V |
| Programmable power | NO |
| Certification status | Not Qualified |
| minimum slew rate | 0.02 V/us |
| Nominal slew rate | 0.11 V/us |
| Maximum slew rate | 0.035 mA |
| Supply voltage upper limit | 7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Nominal Uniform Gain Bandwidth | 220 kHz |
| Minimum voltage gain | 35000 |
| broadband | NO |
| Base Number Matches | 1 |
| TLV2450Y | TLV2454Y | |
|---|---|---|
| Description | OP-AMP, 2000uV OFFSET-MAX, 0.22MHz BAND WIDTH, UUC6, DIE | QUAD OP-AMP, 2000uV OFFSET-MAX, 0.22MHz BAND WIDTH, UUC14, DIE |
| Parts packaging code | DIE | DIE |
| package instruction | DIE | DIE |
| Contacts | 6 | 14 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.007 µA | 0.007 µA |
| Maximum bias current (IIB) at 25C | 0.005 µA | 0.005 µA |
| Nominal Common Mode Rejection Ratio | 66 dB | 66 dB |
| frequency compensation | YES | YES |
| Maximum input offset voltage | 2000 µV | 2000 µV |
| JESD-30 code | R-XUUC-N6 | R-XUUC-N14 |
| low-bias | NO | NO |
| low-dissonance | NO | NO |
| micropower | YES | YES |
| Number of functions | 1 | 4 |
| Number of terminals | 6 | 14 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIE | DIE |
| Encapsulate equivalent code | DIE OR CHIP | DIE OR CHIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | UNCASED CHIP |
| power | NO | NO |
| power supply | +-1.35/+-3/2.7/6 V | +-1.35/+-3/2.7/6 V |
| Programmable power | NO | NO |
| Certification status | Not Qualified | Not Qualified |
| minimum slew rate | 0.02 V/us | 0.02 V/us |
| Nominal slew rate | 0.11 V/us | 0.11 V/us |
| Supply voltage upper limit | 7 V | 7 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD |
| Terminal location | UPPER | UPPER |
| Nominal Uniform Gain Bandwidth | 220 kHz | 220 kHz |
| Minimum voltage gain | 35000 | 35000 |
| broadband | NO | NO |
| Base Number Matches | 1 | 1 |
Embedded System
Embedded System
Embedded System
PCB Design
PCB Design
stm32/stm8
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