Basic information of TLV2454Y amplifier:
TLV2454Y is an OPERATIONAL AMPLIFIER. The commonly used packaging method is DIE
TLV2454Y amplifier core information:
The minimum operating temperature of the TLV2454Y is , and the maximum operating temperature is 70 °C. Maximum bias current at 25°C: 0.005 µA Maximum average bias current is 0.007 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLV2454Y is 0.11 V/us. The minimum slew rate of the TLV2454Y given by the manufacturer is 0.02 V/us. Its minimum voltage gain is 35000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2454Y gain becomes 0.707 times the low-frequency gain is 220 kHz. The power of TLV2454Y is NO. Its programmable power is NO.
The nominal supply voltage of the TLV2454Y is 5 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2454Y is 2000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2454Y:
TLV2454Y has 14 terminals. Its terminal position type is: UPPER. Total pins: 14
TLV2454Y amplifier additional information:
TLV2454Y adopts VOLTAGE-FEEDBACK architecture. It is not a low-bias amplifier. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2454Y is: YES. Its temperature grade is: COMMERCIAL.
It is a micropower amplifier. The corresponding JESD-30 code is: R-XUUC-N14. The package code of TLV2454Y is: DIE. The materials used in the TLV2454Y package are mostly UNSPECIFIED. The package shape is RECTANGULAR.
The TLV2454Y package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
Basic information of TLV2454Y amplifier:
TLV2454Y is an OPERATIONAL AMPLIFIER. The commonly used packaging method is DIE
TLV2454Y amplifier core information:
The minimum operating temperature of the TLV2454Y is , and the maximum operating temperature is 70 °C. Maximum bias current at 25°C: 0.005 µA Maximum average bias current is 0.007 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLV2454Y is 0.11 V/us. The minimum slew rate of the TLV2454Y given by the manufacturer is 0.02 V/us. Its minimum voltage gain is 35000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2454Y gain becomes 0.707 times the low-frequency gain is 220 kHz. The power of TLV2454Y is NO. Its programmable power is NO.
The nominal supply voltage of the TLV2454Y is 5 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the TLV2454Y is 2000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2454Y:
TLV2454Y has 14 terminals. Its terminal position type is: UPPER. Total pins: 14
TLV2454Y amplifier additional information:
TLV2454Y adopts VOLTAGE-FEEDBACK architecture. It is not a low-bias amplifier. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2454Y is: YES. Its temperature grade is: COMMERCIAL.
It is a micropower amplifier. The corresponding JESD-30 code is: R-XUUC-N14. The package code of TLV2454Y is: DIE. The materials used in the TLV2454Y package are mostly UNSPECIFIED. The package shape is RECTANGULAR.
The TLV2454Y package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
| Parameter Name | Attribute value |
| Parts packaging code | DIE |
| package instruction | DIE |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.007 µA |
| Maximum bias current (IIB) at 25C | 0.005 µA |
| Nominal Common Mode Rejection Ratio | 66 dB |
| frequency compensation | YES |
| Maximum input offset voltage | 2000 µV |
| JESD-30 code | R-XUUC-N14 |
| low-bias | NO |
| low-dissonance | NO |
| micropower | YES |
| Negative supply voltage upper limit | |
| Nominal Negative Supply Voltage (Vsup) | |
| Number of functions | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Encapsulate equivalent code | DIE OR CHIP |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| power | NO |
| power supply | +-1.35/+-3/2.7/6 V |
| Programmable power | NO |
| Certification status | Not Qualified |
| minimum slew rate | 0.02 V/us |
| Nominal slew rate | 0.11 V/us |
| Supply voltage upper limit | 7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Nominal Uniform Gain Bandwidth | 220 kHz |
| Minimum voltage gain | 35000 |
| broadband | NO |
| Base Number Matches | 1 |
| TLV2454Y | TLV2450Y | |
|---|---|---|
| Description | QUAD OP-AMP, 2000uV OFFSET-MAX, 0.22MHz BAND WIDTH, UUC14, DIE | OP-AMP, 2000uV OFFSET-MAX, 0.22MHz BAND WIDTH, UUC6, DIE |
| Parts packaging code | DIE | DIE |
| package instruction | DIE | DIE |
| Contacts | 14 | 6 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.007 µA | 0.007 µA |
| Maximum bias current (IIB) at 25C | 0.005 µA | 0.005 µA |
| Nominal Common Mode Rejection Ratio | 66 dB | 66 dB |
| frequency compensation | YES | YES |
| Maximum input offset voltage | 2000 µV | 2000 µV |
| JESD-30 code | R-XUUC-N14 | R-XUUC-N6 |
| low-bias | NO | NO |
| low-dissonance | NO | NO |
| micropower | YES | YES |
| Number of functions | 4 | 1 |
| Number of terminals | 14 | 6 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIE | DIE |
| Encapsulate equivalent code | DIE OR CHIP | DIE OR CHIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | UNCASED CHIP |
| power | NO | NO |
| power supply | +-1.35/+-3/2.7/6 V | +-1.35/+-3/2.7/6 V |
| Programmable power | NO | NO |
| Certification status | Not Qualified | Not Qualified |
| minimum slew rate | 0.02 V/us | 0.02 V/us |
| Nominal slew rate | 0.11 V/us | 0.11 V/us |
| Supply voltage upper limit | 7 V | 7 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | YES |
| technology | BIPOLAR | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD |
| Terminal location | UPPER | UPPER |
| Nominal Uniform Gain Bandwidth | 220 kHz | 220 kHz |
| Minimum voltage gain | 35000 | 35000 |
| broadband | NO | NO |
| Base Number Matches | 1 | 1 |
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