USB3300-EZK datasheet, PDF - EEWORLD Datasheet

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USB3300-EZK: DescriptionDATACOM, INTERFACE CIRCUIT, QCC32; CategoryWireless rf/communication Telecom circuit; File Size634KB，55 Pages; ManufacturerSMSC; Websitehttp://www.smsc.com/; Environmental Compliance

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USB3300-EZK Overview

DATACOM, INTERFACE CIRCUIT, QCC32

USB3300-EZK Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SMSC
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	32
Reach Compliance Code	compli
JESD-30 code	S-XQCC-N32
JESD-609 code	e3
length	5 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	INTERFACE CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm

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USB3300

Hi-Speed USB Host,

Device or OTG PHY with

ULPI Low Pin Interface

PRODUCT FEATURES

USB-IF Hi-Speed certified to the Universal Serial Bus

Specification Rev 2.0

Interface compliant with the ULPI Specification

revision 1.1 in 8-bit mode

Industry standard UTMI+ Low Pin Interface (ULPI)

Converts 54 UTMI+ signals into a standard 12 pin

Link controller interface

54.7mA Unconfigured Current (typical) - ideal for bus

powered applications

83uA suspend current (typical) - ideal for battery

powered applications

Latch-Up performance exceeds 150 mA per

EIA/JESD 78, Class II

ESD protection levels of

8kV HBM without external

protection devices

Integrated protection to withstand IEC61000-4-2 ESD

tests (

8kV contact and

15kV air) per 3rd party test

facility

Supports FS pre-amble for FS hubs with a LS device

attached (UTMI+ Level 3)

Supports HS SOF and LS keep-alive pulse

Includes full support for the optional On-The-Go

(OTG) protocol detailed in the On-The-Go

Supplement Revision 1.0a specification

Supports the OTG Host Negotiation Protocol (HNP)

and Session Request Protocol (SRP)

Allows host to turn VBUS off to conserve battery

power in OTG applications

Supports OTG monitoring of VBUS levels with

internal comparators. Includes support for an external

VBUS or fault monitor.

Datasheet

Low Latency Hi-Speed Receiver (43 Hi-Speed clocks

Max) allows use of legacy UTMI Links with a ULPI

wrapper

Integrated Pull-up resistor on STP for interface

protection allows a reliable Link/PHY start-up with

slow Links (software configured for low power)

Internal 1.8 volt regulators allow operation from a

single 3.3 volt supply

Internal short circuit protection of ID, DP and DM

lines to VBUS or ground

Integrated 24MHz Crystal Oscillator supports either

crystal operation or 24MHz external clock input

Internal PLL for 480MHz Hi-Speed USB operation

Industrial Operating Temperature -40°C to +85°C

32 pin, QFN lead-free RoHS Compliant package

(5 x 5 x 0.90 mm height)

Applications

The USB3300 is the ideal companion to any ASIC, SoC

or FPGA solution designed with a ULPI Hi-Speed USB

host, peripheral or OTG core.

The USB3300 is well suited for:

Cell Phones

PDAs

MP3 Players

Scanners

External Hard Drives

Digital Still and Video Cameras

Portable Media Players

Printers

SMSC USB3300

DATASHEET

Revision 1.08 (11-07-07)

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface

Datasheet

ORDER NUMBERS:

USB3300-EZK for 32 pin, QFN Lead-Free RoHS Compliant Package

USB3300-EZK-TR for 32 pin, QFN Lead-Free RoHS Compliant Package (tape and reel)

Reel Size is 4000 pieces.

80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123

Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for

construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC

reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications

before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent

rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated

version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors

known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not

designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property

damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of

this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered

trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.

SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,

FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE

OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL

DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;

TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD

TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Revision 1.08 (11-07-07)

SMSC USB3300

DATASHEET

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface

Datasheet

Table of Contents

0.1 Reference Documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Chapter 1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Chapter 2 Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chapter 3 Pin Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.1 USB3300 Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.2 Pin Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Chapter 4 Operational Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Chapter 5 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Chapter 6 Architecture Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.1 ULPI Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.2 ULPI Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.3 ULPI Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.4 ULPI Register Array. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.5 ULPI Register Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.6 ULPI RXD CMD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.7 USB3300 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.8 USB3300 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.9 Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.10 Full Speed/Low Speed Serial Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.11 Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.2 Hi-Speed USB Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.2.1 High Speed and Full Speed Transceivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.2.2 Termination Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.2.3 Bias Generator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.3 Crystal Oscillator and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.4 Internal Regulators and POR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.4.1 Internal Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.4.2 Power On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.5 USB On-The-Go (OTG) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.5.1 ID Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.5.2 VBUS Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.5.3 Driving External Vbus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.5.4 External Vbus Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 7 Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

7.1 Application Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.2 Multi-port Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.3 Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.4 ESD Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.4.1 Human Body Model (HBM) Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7.4.2 IEC61000-4-2 Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 8 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Revision 1.08 (11-07-07)

SMSC USB3300

DATASHEET

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface

Datasheet

List of Figures

Figure 1.1

Figure 1.2

Figure 2.1

Figure 3.1

Figure 6.1

Figure 6.2

Figure 6.3

Figure 6.4

Figure 6.5

Figure 6.6

Figure 6.7

Figure 6.8

Figure 6.9

Figure 6.10

Figure 7.1

Figure 7.2

Figure 7.3

Figure 7.4

Figure 8.1

Figure 8.2

Figure 8.3

Basic ULPI USB Device Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

ULPI Interface Features as Related to UTMI+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

USB3300 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

USB3300 Pin Diagram - Top View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Simplified USB3300 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

ULPI Digital Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

ULPI Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

ULPI Register Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

ULPI Register Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

ULPI Transmit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

ULPI Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Entering Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Exiting Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

USB3300 On-the-Go Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

USB3300 Application Diagram (Peripheral). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

USB3300 Application Diagram (Host or OTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

USB3300 Application Diagram (Peripheral with Over Voltage Protection) . . . . . . . . . . . . . . 49

Expanding Downstream Ports for USB3300 Host Applications . . . . . . . . . . . . . . . . . . . . . . . 50

USB3300-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free) . . . . . . . . . 52

QFN, 5x5 Taping Dimensions and Part Orientation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Reel Dimensions for 12mm Carrier Tape. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Tape Length and Part Quantity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

SMSC USB3300

Revision 1.08 (11-07-07)

DATASHEET

USB3300-EZK Related Products

	USB3300-EZK	USB3300	USB3300_07
Description	DATACOM, INTERFACE CIRCUIT, QCC32	DATACOM, INTERFACE CIRCUIT, QCC32	DATACOM, INTERFACE CIRCUIT, QCC32
Number of functions	1	1	1
Number of terminals	32	32	32
Maximum operating temperature	85 °C	85 Cel	85 Cel
Minimum operating temperature	-40 °C	-40 Cel	-40 Cel
surface mount	YES	Yes	Yes
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO	NO
Terminal location	QUAD	Four	Four
Rated supply voltage	-	3.3 V	3.3 V
Processing package description	-	5 × 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32	5 × 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32
Lead-free	-	Yes	Yes
EU RoHS regulations	-	Yes	Yes
state	-	CONSULT MFR	CONSULT MFR
packaging shape	-	SQUARE	SQUARE
Package Size	-	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Terminal spacing	-	0.5000 mm	0.5000 mm
terminal coating	-	MATTE Tin	MATTE Tin
Packaging Materials	-	UNSPECIFIED	UNSPECIFIED
Communication type	-	Interface Circuit	Interface Circuit

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