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USB3300_07

Description
DATACOM, INTERFACE CIRCUIT, QCC32
CategoryTopical application    Wireless rf/communication   
File Size634KB,55 Pages
ManufacturerSMSC
Websitehttp://www.smsc.com/
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USB3300_07 Overview

DATACOM, INTERFACE CIRCUIT, QCC32

USB3300_07 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals32
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Rated supply voltage3.3 V
Processing package description5 × 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32
Lead-freeYes
EU RoHS regulationsYes
stateCONSULT MFR
packaging shapeSQUARE
Package SizeChip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
surface mountYes
Terminal formNO
Terminal spacing0.5000 mm
terminal coatingMATTE Tin
Terminal locationFour
Packaging MaterialsUNSPECIFIED
Temperature levelINDUSTRIAL
Communication typeInterface Circuit
USB3300
Hi-Speed USB Host,
Device or OTG PHY with
ULPI Low Pin Interface
PRODUCT FEATURES
USB-IF Hi-Speed certified to the Universal Serial Bus
Specification Rev 2.0
Interface compliant with the ULPI Specification
revision 1.1 in 8-bit mode
Industry standard UTMI+ Low Pin Interface (ULPI)
Converts 54 UTMI+ signals into a standard 12 pin
Link controller interface
54.7mA Unconfigured Current (typical) - ideal for bus
powered applications
83uA suspend current (typical) - ideal for battery
powered applications
Latch-Up performance exceeds 150 mA per
EIA/JESD 78, Class II
ESD protection levels of
±
8kV HBM without external
protection devices
Integrated protection to withstand IEC61000-4-2 ESD
tests (
±
8kV contact and
±
15kV air) per 3rd party test
facility
Supports FS pre-amble for FS hubs with a LS device
attached (UTMI+ Level 3)
Supports HS SOF and LS keep-alive pulse
Includes full support for the optional On-The-Go
(OTG) protocol detailed in the On-The-Go
Supplement Revision 1.0a specification
Supports the OTG Host Negotiation Protocol (HNP)
and Session Request Protocol (SRP)
Allows host to turn VBUS off to conserve battery
power in OTG applications
Supports OTG monitoring of VBUS levels with
internal comparators. Includes support for an external
VBUS or fault monitor.
Datasheet
Low Latency Hi-Speed Receiver (43 Hi-Speed clocks
Max) allows use of legacy UTMI Links with a ULPI
wrapper
Integrated Pull-up resistor on STP for interface
protection allows a reliable Link/PHY start-up with
slow Links (software configured for low power)
Internal 1.8 volt regulators allow operation from a
single 3.3 volt supply
Internal short circuit protection of ID, DP and DM
lines to VBUS or ground
Integrated 24MHz Crystal Oscillator supports either
crystal operation or 24MHz external clock input
Internal PLL for 480MHz Hi-Speed USB operation
Industrial Operating Temperature -40°C to +85°C
32 pin, QFN lead-free RoHS Compliant package
(5 x 5 x 0.90 mm height)
Applications
The USB3300 is the ideal companion to any ASIC, SoC
or FPGA solution designed with a ULPI Hi-Speed USB
host, peripheral or OTG core.
The USB3300 is well suited for:
Cell Phones
PDAs
MP3 Players
Scanners
External Hard Drives
Digital Still and Video Cameras
Portable Media Players
Printers
SMSC USB3300
DATASHEET
Revision 1.08 (11-07-07)

USB3300_07 Related Products

USB3300_07 USB3300 USB3300-EZK
Description DATACOM, INTERFACE CIRCUIT, QCC32 DATACOM, INTERFACE CIRCUIT, QCC32 DATACOM, INTERFACE CIRCUIT, QCC32
Number of functions 1 1 1
Number of terminals 32 32 32
Maximum operating temperature 85 Cel 85 Cel 85 °C
Minimum operating temperature -40 Cel -40 Cel -40 °C
surface mount Yes Yes YES
Terminal form NO NO NO LEAD
Terminal location Four Four QUAD
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Rated supply voltage 3.3 V 3.3 V -
Processing package description 5 × 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32 5 × 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32 -
Lead-free Yes Yes -
EU RoHS regulations Yes Yes -
state CONSULT MFR CONSULT MFR -
packaging shape SQUARE SQUARE -
Package Size Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Chip CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE -
Terminal spacing 0.5000 mm 0.5000 mm -
terminal coating MATTE Tin MATTE Tin -
Packaging Materials UNSPECIFIED UNSPECIFIED -
Communication type Interface Circuit Interface Circuit -

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