VS8022FC datasheet, PDF - EEWORLD Datasheet

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VS8022FC: DescriptionMux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52; CategoryWireless rf/communication Telecom circuit; File Size272KB，20 Pages; ManufacturerVitesse Semiconductor Corporation; Websitehttp://www.vitesse.com/

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VS8022FC Overview

Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52

VS8022FC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFN
package instruction	HQCCN, QFL52,.75SQ
Contacts	52
Reach Compliance Code	unknown
app	SONET
JESD-30 code	S-CQCC-N52
JESD-609 code	e0
length	19.05 mm
Negative supply voltage rating	-5.2 V
Number of functions	1
Number of terminals	52
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HQCCN
Encapsulate equivalent code	QFL52,.75SQ
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG
power supply	-5.2 V
Certification status	Not Qualified
Maximum seat height	2.79 mm
Maximum slew rate	600 mA
surface mount	YES
technology	GAAS
Telecom integrated circuit types	ATM/SONET/SDH MUX/DEMUX
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	19.05 mm
Base Number Matches	1

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VITESSE

Data Sheet

Features

• Serial Data Rates up to 2.5 Gb/s

• Parallel Data Rates up to 312.5 Mb/s

• ECL 100K Compatible Parallel Data I/Os

• Divide-by-8 Clock for Synchronization of

Parallel Data to Interfacing Chips

• SONET Frame Recovery Circuitry (VS8022)

• Compatible with STS-3 to STS-48

SONET Applications

VS8021/8022

2.5 Gbits/sec SONET Compatible

8-bit Mux/Demux Chipset

• Differential or Single-Ended Inputs and Outputs

• Low Power Dissipation: 2.3W (Typ. Per Chip)

• Standard ECL Power Supplies: VEE = -5.2 V,

VTT = -2.0 V

• Available in Commercial (0

to +70° C) or

Industrial (-40° to +85° C) Temperature Ranges

• Proven E/D Mode GaAs Technology

• 52-pin Leaded Ceramic Chip Carrier

Functional Description

The VS8021 and VS8022 are high speed SONET interface devices capable of handling serial data at rates

up to 2.5 Gbits/second. These products can be used for STS-3 through STS-48 SONET applications.

These products are fabricated in gallium arsenide using the Vitesse H-GaAs

™

E/D MESFET process which

achieves high speed and low power dissipation. These products are packaged in a ceramic 52-pin leaded

ceramic chip carrier.

VS8021

The VS8021 contains an 8:1 multiplexer and a self-positioning timer. The 8:1 multiplexer accepts 8 parallel

differential ECL data inputs (D1-D8, D1N-D8N) at rates up to 312.5 Mbits/sec and multiplexes them into a

serial differential bit stream output (DO, DON) at rates up to 2.5 Gbits/sec.

The internal timing of the VS8021 is built around the high speed clock (up to 2.5 GHz) delivered onto the

chip through a differential input (CLKI, CLKIN). This signal is subsequently echoed at the high speed differen-

tial output (CO, CON).

The parallel data inputs are clocked to on-chip input registers with an externally supplied differential ECL

input (BYCLK, BYCLKN) operating at the same rate as the data inputs. An internal byte clock, which is a

divide by 8 version of the high speed clock, is used to transfer the data to a set of buffer registers. This internal

byte clock is brought off chip at the ECL output CLK8, CLK8N.

Internal circuitry monitors the internal and external byte clocks and generates an ERR signal if a timing

violation is detected. This signal can be gated to the SYNC input which is edge sensitive high. An active SYNC

input allows the VS8021 timing to shift, positioning it properly against the external byte clock, CLK8, CLK8N.

When a CLK8 timing switch is made, normal data ﬂow will be invalid for 1 byte.

There are two clock inputs, namely the CLKI and BYCLK, going into the VS8021. These two clocks serve

as timing references for different parts of the VS8021. The BYCLK is used to trigger the input registers for the

parallel data inputs, while the CLKI is used to trigger the high speed serial output register as well as some of the

timing circuitry for the parallel to serial conversion. Furthermore, in order to make this part easy to use, the user

is not required to assume a known phase relationship between CLKI and the BYCLK.

G52028-0 Rev. 4.0

VITESSE

Seiconductor Corporation

Page 1

VS8022FC Related Products

	VS8022FC	VS8022FI	VS8021FC	VS8021FI
Description	Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52	Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52	Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52	Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFN	QFN	QFN	QFN
package instruction	HQCCN, QFL52,.75SQ	HQCCN, QFL52,.75SQ	HQCCN, QFL52,.75SQ	HQCCN, QFL52,.75SQ
Contacts	52	52	52	52
Reach Compliance Code	unknown	unknown	unknown	unknown
app	SONET	SONET	SONET	SONET
JESD-30 code	S-CQCC-N52	S-CQCC-N52	S-CQCC-N52	S-CQCC-N52
JESD-609 code	e0	e0	e0	e0
length	19.05 mm	19.05 mm	19.05 mm	19.05 mm
Negative supply voltage rating	-5.2 V	-5.2 V	-5.2 V	-5.2 V
Number of functions	1	1	1	1
Number of terminals	52	52	52	52
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HQCCN	HQCCN	HQCCN	HQCCN
Encapsulate equivalent code	QFL52,.75SQ	QFL52,.75SQ	QFL52,.75SQ	QFL52,.75SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG	CHIP CARRIER, HEAT SINK/SLUG
power supply	-5.2 V	-5.2 V	-5.2 V	-5.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.79 mm	2.79 mm	2.79 mm	2.79 mm
Maximum slew rate	600 mA	600 mA	600 mA	600 mA
surface mount	YES	YES	YES	YES
technology	GAAS	GAAS	GAAS	GAAS
Telecom integrated circuit types	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX	ATM/SONET/SDH MUX/DEMUX
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
width	19.05 mm	19.05 mm	19.05 mm	19.05 mm
Base Number Matches	1	1	1	1

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