EEWORLDEEWORLDEEWORLD

Part Number

Search

VS8022FI

Description
Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52
CategoryWireless rf/communication    Telecom circuit   
File Size272KB,20 Pages
ManufacturerVitesse Semiconductor Corporation
Websitehttp://www.vitesse.com/
Download Datasheet Parametric Compare View All

VS8022FI Overview

Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52

VS8022FI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFN
package instructionHQCCN, QFL52,.75SQ
Contacts52
Reach Compliance Codeunknown
appSONET
JESD-30 codeS-CQCC-N52
JESD-609 codee0
length19.05 mm
Negative supply voltage rating-5.2 V
Number of functions1
Number of terminals52
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeHQCCN
Encapsulate equivalent codeQFL52,.75SQ
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG
power supply-5.2 V
Certification statusNot Qualified
Maximum seat height2.79 mm
Maximum slew rate600 mA
surface mountYES
technologyGAAS
Telecom integrated circuit typesATM/SONET/SDH MUX/DEMUX
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width19.05 mm
Base Number Matches1
VITESSE
Data Sheet
Features
• Serial Data Rates up to 2.5 Gb/s
• Parallel Data Rates up to 312.5 Mb/s
• ECL 100K Compatible Parallel Data I/Os
• Divide-by-8 Clock for Synchronization of
Parallel Data to Interfacing Chips
• SONET Frame Recovery Circuitry (VS8022)
• Compatible with STS-3 to STS-48
SONET Applications
VS8021/8022
2.5 Gbits/sec SONET Compatible
8-bit Mux/Demux Chipset
• Differential or Single-Ended Inputs and Outputs
• Low Power Dissipation: 2.3W (Typ. Per Chip)
• Standard ECL Power Supplies: VEE = -5.2 V,
VTT = -2.0 V
• Available in Commercial (0
°
to +70° C) or
Industrial (-40° to +85° C) Temperature Ranges
• Proven E/D Mode GaAs Technology
• 52-pin Leaded Ceramic Chip Carrier
Functional Description
The VS8021 and VS8022 are high speed SONET interface devices capable of handling serial data at rates
up to 2.5 Gbits/second. These products can be used for STS-3 through STS-48 SONET applications.
These products are fabricated in gallium arsenide using the Vitesse H-GaAs
E/D MESFET process which
achieves high speed and low power dissipation. These products are packaged in a ceramic 52-pin leaded
ceramic chip carrier.
VS8021
The VS8021 contains an 8:1 multiplexer and a self-positioning timer. The 8:1 multiplexer accepts 8 parallel
differential ECL data inputs (D1-D8, D1N-D8N) at rates up to 312.5 Mbits/sec and multiplexes them into a
serial differential bit stream output (DO, DON) at rates up to 2.5 Gbits/sec.
The internal timing of the VS8021 is built around the high speed clock (up to 2.5 GHz) delivered onto the
chip through a differential input (CLKI, CLKIN). This signal is subsequently echoed at the high speed differen-
tial output (CO, CON).
The parallel data inputs are clocked to on-chip input registers with an externally supplied differential ECL
input (BYCLK, BYCLKN) operating at the same rate as the data inputs. An internal byte clock, which is a
divide by 8 version of the high speed clock, is used to transfer the data to a set of buffer registers. This internal
byte clock is brought off chip at the ECL output CLK8, CLK8N.
Internal circuitry monitors the internal and external byte clocks and generates an ERR signal if a timing
violation is detected. This signal can be gated to the SYNC input which is edge sensitive high. An active SYNC
input allows the VS8021 timing to shift, positioning it properly against the external byte clock, CLK8, CLK8N.
When a CLK8 timing switch is made, normal data flow will be invalid for 1 byte.
There are two clock inputs, namely the CLKI and BYCLK, going into the VS8021. These two clocks serve
as timing references for different parts of the VS8021. The BYCLK is used to trigger the input registers for the
parallel data inputs, while the CLKI is used to trigger the high speed serial output register as well as some of the
timing circuitry for the parallel to serial conversion. Furthermore, in order to make this part easy to use, the user
is not required to assume a known phase relationship between CLKI and the BYCLK.
G52028-0 Rev. 4.0
®
VITESSE
Seiconductor Corporation
Page 1

VS8022FI Related Products

VS8022FI VS8022FC VS8021FC VS8021FI
Description Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52 Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52 Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52 Mux/Demux, 1-Func, GAAS, CQCC52, HEAT SINK, CAVITY DOWN, CERAMIC, LDCC-52
Is it Rohs certified? incompatible incompatible incompatible incompatible
Parts packaging code QFN QFN QFN QFN
package instruction HQCCN, QFL52,.75SQ HQCCN, QFL52,.75SQ HQCCN, QFL52,.75SQ HQCCN, QFL52,.75SQ
Contacts 52 52 52 52
Reach Compliance Code unknown unknown unknown unknown
app SONET SONET SONET SONET
JESD-30 code S-CQCC-N52 S-CQCC-N52 S-CQCC-N52 S-CQCC-N52
JESD-609 code e0 e0 e0 e0
length 19.05 mm 19.05 mm 19.05 mm 19.05 mm
Negative supply voltage rating -5.2 V -5.2 V -5.2 V -5.2 V
Number of functions 1 1 1 1
Number of terminals 52 52 52 52
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code HQCCN HQCCN HQCCN HQCCN
Encapsulate equivalent code QFL52,.75SQ QFL52,.75SQ QFL52,.75SQ QFL52,.75SQ
Package shape SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG CHIP CARRIER, HEAT SINK/SLUG CHIP CARRIER, HEAT SINK/SLUG CHIP CARRIER, HEAT SINK/SLUG
power supply -5.2 V -5.2 V -5.2 V -5.2 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.79 mm 2.79 mm 2.79 mm 2.79 mm
Maximum slew rate 600 mA 600 mA 600 mA 600 mA
surface mount YES YES YES YES
technology GAAS GAAS GAAS GAAS
Telecom integrated circuit types ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX ATM/SONET/SDH MUX/DEMUX
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD
width 19.05 mm 19.05 mm 19.05 mm 19.05 mm
Base Number Matches 1 1 1 1

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1807  2706  360  311  2083  37  55  8  7  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号