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3256A

Description
EE PLD, 18 ns, PQFP160
Categorysemiconductor    Programmable logic devices   
File Size126KB,13 Pages
ManufacturerLattice
Websitehttp://www.latticesemi.com
Download Datasheet Parametric Compare View All

3256A Overview

EE PLD, 18 ns, PQFP160

3256A Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals160
Maximum operating temperature70 Cel
Minimum operating temperature0.0 Cel
Maximum supply/operating voltage5.25 V
Minimum supply/operating voltage4.75 V
Rated supply voltage5 V
Number of input and output buses128
Processing package descriptionPlastic, Quad Flat Package-160
stateDISCONTINUED
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeFLATPACK
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
terminal coatingtin lead
Terminal locationFour
Packaging MaterialsPlastic/Epoxy
Temperature levelCOMMERCIAL
organize0 DEDICATED INPUTS, 128 I/O
Maximum FCLK clock frequency50 MHz
Output functionMACROCELL
Programmable logic typeelectronic programmable logic devices
propagation delay TPD18 ns
Dedicated input quantity0.0
ispLSI 3256A
®
In-System Programmable High Density PLD
Features
• HIGH-DENSITY PROGRAMMABLE LOGIC
— 128 I/O Pins
— 11000 PLD Gates
— 384 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
• HIGH-PERFORMANCE E
2
CMOS
®
TECHNOLOGY
f
max
= 90 MHz Maximum Operating Frequency
t
pd
= 12 ns Propagation Delay
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
• IN-SYSTEM PROGRAMMABLE
— 5V In-System Programmable (ISP™) using Lattice
ISP or Boundary Scan Test (IEEE 1149.1) Protocol
— Increased Manufacturing Yields, Reduced Time-to-
Market, and Improved Product Quality
— Reprogram Soldered Devices for Faster Debugging
• 100% IEEE 1149.1 BOUNDARY SCAN COMPATIBLE
• OFFERS THE EASE OF USE AND FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
Logic and Structured Designs
— Enhanced Pin Locking Capability
— Five Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control to Mini-
mize Switching Noise
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Interconnectivity
• ispDesignEXPERT™ – LOGIC COMPILER AND COM-
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
Functional Block Diagram
Output Routing Pool
H3
Output Routing Pool
Output Routing Pool
G3
D Q
H2
H1
H0
G2
G1
G0
Boundary
Scan
A1
A2
AND Array
OR
Array
D Q
F2
F1
Twin
GLB
F0
D Q
D Q
A3
D Q
OR
Output Routing Pool
D Q
Array
D Q
B1
B2
D Q
E2
E1
Global Routing Pool
B3
C0
C1
C2
C3
D0
D1
D2
D3
E0
Output Routing Pool
Output Routing Pool
0139A
Description
The ispLSI 3256A is a High-Density Programmable Logic
Device containing 384 Registers, 128 Universal I/O pins,
five Dedicated Clock Input Pins, eight Output Routing
Pools (ORP) and a Global Routing Pool (GRP) which
allows complete inter-connectivity between all of these
elements. The ispLSI 3256A features 5V in-system
programmability and in-system diagnostic capabilities.
The ispLSI 3256A offers non-volatile reprogrammability
of the logic, as well as the interconnect to provide truly
reconfigurable systems.
The basic unit of logic on the ispLSI 3256A device is the
Twin Generic Logic Block (Twin GLB) labelled A0, A1...H3.
There are a total of 32 Twin GLBs in the ispLSI 3256A
device. Each Twin GLB has 24 inputs, a programmable
AND array and two OR/Exclusive-OR Arrays, and eight
outputs which can be configured to be either combinato-
rial or registered. All Twin GLB inputs come from the
GRP.
Copyright © 1999 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
May 1999
3256a_09
1
Output Routing Pool
B0
E3
Output Routing Pool
A0
F3

3256A Related Products

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Description EE PLD, 18 ns, PQFP160 EE PLD, 18 ns, PQFP160 EE PLD, 18 ns, PQFP160 EE PLD, 18 ns, PQFP160 EE PLD, 18 ns, PQFP160 EE PLD, 15 ns, PQFP160
Number of terminals 160 160 160 160 160 160
Maximum operating temperature 70 Cel 70 °C 70 °C 85 °C 85 °C 70 °C
surface mount Yes YES YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location Four QUAD QUAD QUAD QUAD QUAD
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
organize 0 DEDICATED INPUTS, 128 I/O 0 DEDICATED INPUTS, 128 I/O 0 DEDICATED INPUTS, 128 I/O 0 DEDICATED INPUTS, 128 I/O 0 DEDICATED INPUTS, 128 I/O 0 DEDICATED INPUTS, 128 I/O
Output function MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
Programmable logic type electronic programmable logic devices EE PLD EE PLD EE PLD EE PLD EE PLD
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible
Maker - Lattice Lattice Lattice Lattice Lattice
Parts packaging code - QFP QFP QFP QFP QFP
package instruction - MQFP-160 PLASTIC, QFP-160 MQFP-160 PLASTIC, QFP-160 PLASTIC, QFP-160
Contacts - 160 160 160 160 160
Reach Compliance Code - unknow _compli unknow _compli unknow
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99
Other features - YES YES YES YES YES
maximum clock frequency - 37 MHz 50 MHz 37 MHz 50 MHz 61 MHz
In-system programmable - YES YES YES YES YES
JESD-30 code - S-MQFP-G160 S-PQFP-G160 S-MQFP-G160 S-PQFP-G160 S-PQFP-G160
JTAG BST - YES YES YES YES YES
length - 27.69 mm 28 mm 27.69 mm 28 mm 28 mm
Humidity sensitivity level - 1 3 1 3 3
Number of I/O lines - 128 128 128 128 128
Number of macro cells - 256 256 256 256 256
Package body material - METAL PLASTIC/EPOXY METAL PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - QFP QFP QFP QFP QFP
Encapsulate equivalent code - QFP160,1.2SQ QFP160,1.2SQ QFP160,1.2SQ QFP160,1.2SQ QFP160,1.2SQ
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) - 225 225 225 225 225
power supply - 5 V 5 V 5 V 5 V 5 V
propagation delay - 24.5 ns 18 ns 24.5 ns 18 ns 15 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 3.96 mm 4.1 mm 3.96 mm 4.1 mm 4.1 mm
Maximum supply voltage - 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V
Minimum supply voltage - 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V
Nominal supply voltage - 5 V 5 V 5 V 5 V 5 V
technology - CMOS CMOS CMOS CMOS CMOS
Terminal pitch - 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Maximum time at peak reflow temperature - NOT SPECIFIED 30 NOT SPECIFIED 30 30
width - 27.69 mm 28 mm 27.69 mm 28 mm 28 mm
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