Inverter, HCT Series, 6-Func, 1-Input, CMOS
| Parameter Name | Attribute value |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| series | HCT |
| JESD-30 code | X-XUUC-N14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | INVERTER |
| Number of functions | 6 |
| Number of entries | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| propagation delay (tpd) | 21 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| total dose | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9571901V9A | HCTS14DMSR | HCTS14KMSR | HCTS14K/SAMPLE | HCTS14D/SAMPLE | HCTS14HMSR | |
|---|---|---|---|---|---|---|
| Description | Inverter, HCT Series, 6-Func, 1-Input, CMOS | Inverter, HCT Series, 6-Func, 1-Input, CMOS, CDIP14 | Inverter, HCT Series, 6-Func, 1-Input, CMOS, CDFP14 | Inverter, HCT Series, 6-Func, 1-Input, CMOS, CDFP14 | Inverter, HCT Series, 6-Func, 1-Input, CMOS, CDIP14 | Inverter, HCT Series, 6-Func, 1-Input, CMOS |
| package instruction | DIE, | DIP, DIP14,.3 | DFP, FL14,.3 | , | , | DIE, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| series | HCT | HCT | HCT | HCT | HCT | HCT |
| JESD-30 code | X-XUUC-N14 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 | R-CDIP-T14 | X-XUUC-N14 |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| Number of functions | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of entries | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Package body material | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| Package shape | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | UNCASED CHIP | IN-LINE | FLATPACK | FLATPACK | IN-LINE | UNCASED CHIP |
| propagation delay (tpd) | 21 ns | 21 ns | 21 ns | 21 ns | 21 ns | 21 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal form | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | NO LEAD |
| Terminal location | UPPER | DUAL | DUAL | DUAL | DUAL | UPPER |
| encapsulated code | DIE | DIP | DFP | - | - | DIE |
| Maker | - | Harris | Harris | Harris | Harris | Harris |