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THS3120DGN

Description

Basic information of THS3120DGN amplifier:

THS3120DGN is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are PLASTIC, MSOP-8

THS3120DGN amplifier core information:

Related dimensions of THS3120DGN:

The width of THS3120DGN is: 3 mm, and the length is 3 mm. THS3120DGN has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.65 mm. Total pins: 8

THS3120DGN amplifier additional information:

Its temperature grade is: INDUSTRIAL. It contains lead. The corresponding JESD-30 code is: S-PDSO-G8. The packaging code of THS3120DGN is: HTSSOP. The materials used for THS3120DGN packaging are mostly PLASTIC/EPOXY.

The package shape is SQUARE. THS3120DGN package pin formats are: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING. The maximum seat height is 1.07 mm.

CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size902KB,30 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Alternative parts:THS3120DGN
Stay tuned Parametric Compare

THS3120DGN Overview

Basic information of THS3120DGN amplifier:

THS3120DGN is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are PLASTIC, MSOP-8

THS3120DGN amplifier core information:

Related dimensions of THS3120DGN:

The width of THS3120DGN is: 3 mm, and the length is 3 mm. THS3120DGN has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.65 mm. Total pins: 8

THS3120DGN amplifier additional information:

Its temperature grade is: INDUSTRIAL. It contains lead. The corresponding JESD-30 code is: S-PDSO-G8. The packaging code of THS3120DGN is: HTSSOP. The materials used for THS3120DGN packaging are mostly PLASTIC/EPOXY.

The package shape is SQUARE. THS3120DGN package pin formats are: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH. Its terminal forms are: GULL WING. The maximum seat height is 1.07 mm.

THS3120DGN Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Contains lead
Parts packaging codeMSOP
package instructionPLASTIC, MSOP-8
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
JESD-30 codeS-PDSO-G8
length3 mm
Number of functions1
Number of terminals8
Package body materialPLASTIC/EPOXY
encapsulated codeHTSSOP
Package shapeSQUARE
Package formSMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Certification statusNot Qualified
Maximum seat height1.07 mm
surface mountYES
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
width3 mm
Base Number Matches1

THS3120DGN Related Products

THS3120DGN THS3120DGNR
Description Single, Low Noise, High Output Drive, 475mA Current-Feedback Amplifier with Power-down 8-MSOP-PowerPAD -40 to 85 Single, Low Noise, High Output Drive, 475mA Current-Feedback Amplifier with Power-down 8-MSOP-PowerPAD -40 to 85
Brand Name Texas Instruments Texas Instruments
Is it lead-free? Contains lead Contains lead
Parts packaging code MSOP MSOP
package instruction PLASTIC, MSOP-8 PLASTIC, MSOP-8
Contacts 8 8
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
JESD-30 code S-PDSO-G8 S-PDSO-G8
length 3 mm 3 mm
Number of functions 1 1
Number of terminals 8 8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HTSSOP HTSSOP
Package shape SQUARE SQUARE
Package form SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Certification status Not Qualified Not Qualified
Maximum seat height 1.07 mm 1.07 mm
surface mount YES YES
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm
Terminal location DUAL DUAL
width 3 mm 3 mm
Base Number Matches 1 1

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