EEWORLDEEWORLDEEWORLD

Part Number

Search

CCR06CG911FM

Description
Ceramic Capacitor, Ceramic, 200V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00091uF, Through Hole Mount, 2909, RADIAL LEADED
CategoryPassive components    capacitor   
File Size1MB,15 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

CCR06CG911FM Overview

Ceramic Capacitor, Ceramic, 200V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00091uF, Through Hole Mount, 2909, RADIAL LEADED

CCR06CG911FM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
package instruction, 2909
Reach Compliance Codenot_compliant
ECCN codeEAR99
capacitance0.00091 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high7.37 mm
JESD-609 codee0
length7.37 mm
Installation featuresTHROUGH HOLE MOUNT
multi-layerNo
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formRadial
method of packingBULK; TR, 12 INCH
positive tolerance1%
Rated (DC) voltage (URdc)200 V
GuidelineMIL-PRF-20/36
size code2909
surface mountNO
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal pitch5.08 mm
Terminal shapeWIRE
width2.29 mm
Base Number Matches1
MULTILAYER CERAMIC CAPACITORS/AXIAL
& RADIAL LEADED
Multilayer ceramic capacitors are available in a
variety of physical sizes and configurations, including
leaded devices and surface mounted chips. Leaded
styles include molded and conformally coated parts
with axial and radial leads. However, the basic
capacitor element is similar for all styles. It is called a
chip and consists of formulated dielectric materials
which have been cast into thin layers, interspersed
with metal electrodes alternately exposed on opposite
edges of the laminated structure. The entire structure is
fired at high temperature to produce a monolithic
block which provides high capacitance values in a
small physical volume. After firing, conductive
terminations are applied to opposite ends of the chip to
make contact with the exposed electrodes.
Termination materials and methods vary depending on
the intended use.
TEMPERATURE CHARACTERISTICS
Ceramic dielectric materials can be formulated with
Class III:
General purpose capacitors, suitable
a wide range of characteristics. The EIA standard for
for by-pass coupling or other applications in which
ceramic dielectric capacitors (RS-198) divides ceramic
dielectric losses, high insulation resistance and
dielectrics into the following classes:
stability of capacitance characteristics are of little or
no importance. Class III capacitors are similar to Class
Class I:
Temperature compensating capacitors,
II capacitors except for temperature characteristics,
suitable for resonant circuit application or other appli-
which are greater than ± 15%. Class III capacitors
cations where high Q and stability of capacitance char-
have the highest volumetric efficiency and poorest
acteristics are required. Class I capacitors have
stability of any type.
predictable temperature coefficients and are not
affected by voltage, frequency or time. They are made
KEMET leaded ceramic capacitors are offered in
from materials which are not ferro-electric, yielding
the three most popular temperature characteristics:
superior stability but low volumetric efficiency. Class I
C0G:
Class I, with a temperature coefficient of 0 ±
capacitors are the most stable type available, but have
30 ppm per degree C over an operating
the lowest volumetric efficiency.
temperature range of - 55°C to + 125°C (Also
known as “NP0”).
Class II:
Stable capacitors, suitable for bypass
X7R:
Class II, with a maximum capacitance
or coupling applications or frequency discriminating
change of ± 15% over an operating temperature
circuits where Q and stability of capacitance char-
range of - 55°C to + 125°C.
acteristics are not of major importance. Class II
Z5U:
Class III, with a maximum capacitance
capacitors have temperature characteristics of ± 15%
change of + 22% - 56% over an operating tem-
or less. They are made from materials which are
perature range of + 10°C to + 85°C.
ferro-electric, yielding higher volumetric efficiency but
less stability. Class II capacitors are affected by
Specified electrical limits for these three temperature
temperature, voltage, frequency and time.
characteristics are shown in Table 1.
SPECIFIED ELECTRICAL LIMITS
Parameter
Dissipation Factor: Measured at following conditions.
C0G – 1 kHz and 1 vrms if capacitance >1000pF
1 MHz and 1 vrms if capacitance 1000 pF
X7R – 1 kHz and 1 vrms* or if extended cap range 0.5 vrms
Z5U – 1 kHz and 0.5 vrms
Dielectric Stength: 2.5 times rated DC voltage.
Insulation Resistance (IR): At rated DC voltage,
whichever of the two is smaller
Temperature Characteristics: Range, °C
Capacitance Change without
DC voltage
* MHz and 1 vrms if capacitance
100 pF on military product.
Temperature Characteristics
C0G
X7R
2.5%
(3.5% @ 25V)
Z5U
0.10%
4.0%
Pass Subsequent IR Test
1,000 M
F
or 100 G
-55 to +125
0 ± 30 ppm/°C
1,000 M
F
or 100 G
-55 to +125
± 15%
1,000 M
or 10 G
F
+ 10 to +85
+22%,-56%
Table I
4
© KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Analyze the low power consumption and high performance characteristics of multi-core DSP
[size=3] Digital signal processing is the theory and technology of representing and processing signals in digital form. Digital signal processing and analog signal processing are subsets of signal pro...
Jacktang DSP and ARM Processors
FFT Core
RT, FFT core and FFT design information...
open82977352 DSP and ARM Processors
About NXP Cortex-M0, M3, M4 Sample Application
Hello engineers:I am very happy to meet you all here. I am an agent of NXP.As long as you are engaged in product research and development, and your project requires an ARM microcontroller, you only ne...
NXP-Agency NXP MCU
[Show Plan] The handmade quadcopter weighing only 100 grams is still working hard to fly
[i=s]This post was last edited by paulhyde on 2014-9-15 03:20[/i]The topic our group chose in the 2013 National Electronic Design Competition was autonomous quadcopter. Why did we choose this topic? I...
mxj1005071012 Electronics Design Contest
Several key issues in TPMS solutions
[b]Introduction[/b] When driving at high speed, tire failure is the most worrying and difficult to prevent for all drivers, and it is also the main cause of sudden traffic accidents. According to stat...
1ying Automotive Electronics
Create jffs2 file system
Author: Cheng Yaogen, lecturer at Huaqing Yuanjian Embedded School .1. Compilation of zlibUnzip zlib-1.2.3.tar.bz2 and enter zlib-1.2.3 to configure, compile and install$ tar xvf zlib-1.2.3.tar.bz2 $ ...
zhouning201 ARM Technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1967  2246  1703  111  1510  40  46  35  3  31 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号