BYW81HR
Aerospace 1 x 15 A - 200 V fast recovery rectifier
Datasheet
-
production data
Description
Packaged in hermetic SMD.5, this device is
intended for use in medium voltage, high
frequency switching mode power supplies, high
frequency DC to DC converters, and other
aerospace applications.
The complete ESCC specification for this device
is available from the European Space Agency
web site. ST guarantees full compliance of
qualified parts with such ESCC detailed
specifications.
Figure 1. Device configuration
Features
•
Very small conduction losses
•
Negligible switching losses
•
High surge current capability
•
High avalanche energy capability
•
Hermetic packages
•
ESCC qualified
Table 1. Device summary
(1)
Order code
BYW81-200S1
BYW81-200SG
5103/029/05
ESCC part
number
Quality
level
Engineering
model
ESCC flight
Y
EPPL
Package
SMD.5
SMD.5
I
F(AV)
15 A
200 V
15 A
1.15 V
150 °C
V
RRM
V
F (max)
T
j(max)
1. Contact ST sales office for information about the specific conditions for products in die form.
September 2015
This is information on a product in full production.
DocID17735 Rev 3
1/7
www.st.com
Characteristics
BYW81HR
1
Characteristics
Table 2. Absolute maximum ratings
Symbol
Characteristic
Forward surge current
(1)
, variant 05
Repetitive peak reverse voltage
(2)
Average output rectified current (50% duty cycle)
(3)
, variant 05
Forward rms current (per diode), variant 05
Operating case temperature range
Junction temperature
Storage temperature range
Soldering temperature SMD.5
(4)
Value
250
200
15
30
-55 to +150
+150
-55 to +150
+245
Unit
A
V
A
A
°C
°C
°C
°C
I
FSM
V
RRM
I
O
I
F(RMS)
T
OP
T
J
T
STG
T
SOL
1. Sinusoidal pulse of 10 ms duration
2. Pulsed, duration 5 ms, F = 50 Hz
3. For T
case
≥
+110°C, derate linearly to 0 A at +150°C.
4. Duration 5 seconds maximum the same package shall not be re-soldered until 3 minutes have elapsed.
Table 3. Thermal resistance
Symbol
R
th (j-c) (1)
Parameter
Junction to case, all variants (per diode)
Value
2.3
Unit
°C/W
1. Package mounted on infinite heatsink.
2/7
DocID17735 Rev 3
BYW81HR
s
Characteristics
Table 4. Electrical measurements at ambient temperature (per diode), T
amb
= 22 ±3 °C
Symbol
Characteristic
Reverse current
Forward voltage
Breakdown voltage
Capacitance
Reverse recovery time
Relative thermal impedance,
junction to case
MIL-STD-750
test method
4016
4011
4021
4001
4031
3101
Limits
Test conditions
Min.
DC method, V
R
= 200 V
Pulse method, I
F
= 10 A
Pulse method, I
F
= 20 A
I
R
= 100 µA
V
R
= 10 V, F = 1 MHz
I
F
= 1 A, V
R
= 30 V,
dI
F
/dt = -50 A/µs
I
H
= 15 to 40 A, t
H
= 50 ms
I
M
= 50 mA, t
md
= 100 µs
-
-
-
200
-
-
Max.
20
1.0
1.2
-
220
40
µA
V
V
V
pF
ns
°C/W
Units
I
R
V
F1
(1)
V
F2(1)
V
BR
C
t
rr
Z
th(j-c)
(2)
Calculate
ΔV
F(3)
1. Pulse width
≤
680µs, duty cycle
≤
2%
2. Performed only during screening tests parameter drift values (initial measurements), go-no-go.
3. The limits for
ΔVF
shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and
shall guarantee the R
th(j-c)
limits specified in maximum ratings.
Table 5. Electrical measurements at high and low temperatures (per diode)
Symbol
Characteristic
MIL-STD-750
test method
Test
conditions
(1)
Limits
Units
Min.
T
case
= +125 (+0, -5) °C
DC method, V
R
= 200 V
T
case
= +125 (+0, -5) °C
pulse method, I
F
= 10 A
T
case
= +55 (+0, -5) °C
pulse method, I
F
= 10 A
-
-
-
Max.
10
0.85
1.15
mA
V
V
I
R
Reverse current
4016
V
F1
(2)
Forward voltage
4011
1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a
100% inspection may be performed.
2. Pulse width
≤
300µs, duty cycle
≤
2%
DocID17735 Rev 3
3/7
7
Package information
BYW81HR
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
2.1
SMD.5 package information
Figure 2. SMD.5 package outline
e
b2
b3
2
1
D1
A
A1
E
D
b1
3
b
Table 6. SMD.5 package mechanical data
Dimension in millimeters
Reference
Min.
A
A1
b
b1
b2
(1)
b3
(1)
D
D1
(1)
E
e
(1)
1. 2 locations
Dimension in inches
Min.
0.112
0.010
0.281
0.220
0.090
0.115
0.395
0.030
0.291
0.075
Max.
0.124
0.20
0.291
0.230
0.100
0.125
0.405
-
0.301
Max.
3.15
0.51
7.39
5.84
2.54
3.18
10.28
-
7.64
1.91 BSC
2.84
0.25
7.13
5.58
2.28
2.92
10.03
0.76
7.39
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DocID17735 Rev 3
BYW81HR
Ordering information
3
Ordering information
Table 7. Ordering information
(1)
Order code
ESCC part
number
Quality
level
Engineering
model
5103/029/05 ESCC flight
Package
Lead
finish
Marking
(2)
BYW81-200S1
SMD.5
Gold
510302905
2.0 g
Mass Packing
BYW81-200S1
BYW81-200SG
Strip
pack
1. Contact ST sales office for information about the specific conditions for products in die form.
2. Specific marking only. The full marking includes in addition:
For the engineering models: ST logo, date code, country of origin (FR).
For ESCC flight parts: ST logo, date code, country of origin (FR), ESA logo, serial number of the part within the assembly lot.
4
4.1
Other information
Date code
Date code is structured as describe below:
•
•
EM xyywwz
ESCC flight yywwz
–
–
–
–
x (EM only): 3, assembly location Rennes (France)
yy: last two digits year
ww: week digits
z: lot index in the week
Where:
4.2
Documentation
In
Table 8
is a summary of the documentation provided with each type of products.
Table 8. Documentation provided with each type of products
Quality level
Engineering model
ESCC flight
Certificate of conformance
Documentation
DocID17735 Rev 3
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