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M95M01-R_08

Description
128K X 8 SPI BUS SERIAL EEPROM, PDSO8
Categorystorage   
File Size352KB,41 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M95M01-R_08 Overview

128K X 8 SPI BUS SERIAL EEPROM, PDSO8

M95M01-R_08 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals8
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage5.5 V
Minimum supply/operating voltage1.8 V
Rated supply voltage2.5 V
maximum clock frequency5 MHz
Processing package description0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal spacing1.27 mm
terminal coatingNICKEL PALLADIUM GOLD
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width8
organize128K X 8
storage density1.05E6 deg
operating modeSYNCHRONOUS
Number of digits131072 words
Number of digits128K
Memory IC typeSPI BUS SERIAL EEPROM
serial parallelSERIAL
Maximum TWC of write cycle5 ms
M95M01-R M95M01-W
1 Mbit serial SPI bus EEPROM with high speed clock
Datasheet
production data
Features
Compatible with SPI bus serial interface
(Positive Clock SPI modes)
Schmitt trigger inputs for enhanced noise
margin
Single supply voltage: 1.8 V to 5.5 V
High speed
– 5 MHz clock rate
– 5 ms Write time
Status Register
Hardware Protection of the Status Register
Byte and Page Write (up to 256 bytes)
Self-timed programming cycle
Adjustable size read-only EEPROM area
Enhanced ESD Protection
More than 1 000 000 Write cycles
More than 40-year data retention
Packages
– ECOPACK® (RoHS compliant)
SO8W (MW)
208 mils width
SO8N (MN)
150 mils width
TSSOP8 (DW)
169 mils width
WLCSP (CS)
March 2012
This is information on a product in full production.
Doc ID 13264 Rev 8
1/41
www.st.com
1

M95M01-R_08 Related Products

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Description 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 IC EEPROM 1M SPI 16MHZ 8WLCSP
Number of terminals 8 8 8 8 8 8 8
Maximum operating temperature 85 Cel 85 Cel 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 Cel -40 Cel -40 °C -40 °C -40 °C -40 °C -40 °C
surface mount Yes Yes YES YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING BALL
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL BOTTOM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 8 8 8 8 8 8 8
organize 128K X 8 128K X 8 128KX8 128KX8 128KX8 128KX8 128KX8
Number of functions 1 1 1 1 1 1 -
Is it Rohs certified? - - conform to conform to conform to conform to conform to
Maker - - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code - - SOIC SOIC SOIC SOIC -
package instruction - - SOP, SOP8,.3 SOP, SOP8,.25 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 -
Contacts - - 8 8 8 8 -
Reach Compliance Code - - compli compli compli compli unknown
ECCN code - - EAR99 EAR99 EAR99 EAR99 -
Maximum clock frequency (fCLK) - - 5 MHz 5 MHz 5 MHz 5 MHz -
Data retention time - minimum - - 40 40 40 40 40
Durability - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 code - - R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PBGA-B8
JESD-609 code - - e4 e4 e4 e4 -
memory density - - 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bit
Memory IC Type - - EEPROM EEPROM EEPROM EEPROM EEPROM
Humidity sensitivity level - - 1 1 1 1 -
word count - - 131072 words 131072 words 131072 words 131072 words 131072 words
character code - - 128000 128000 128000 128000 128000
Operating mode - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - SOP SOP SOP SOP BGA
Encapsulate equivalent code - - SOP8,.3 SOP8,.25 SOP8,.25 SOP8,.3 BGA8,3X3,47/24
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form - - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE GRID ARRAY
Parallel/Serial - - SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) - - 260 260 260 260 -
power supply - - 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - - 2.5 mm 1.75 mm 1.75 mm 2.5 mm -
Serial bus type - - SPI SPI SPI SPI SPI
Maximum standby current - - 0.000003 A 0.000003 A 0.000003 A 0.000003 A 0.000003 A
Maximum slew rate - - 0.005 mA 0.005 mA 0.005 mA 0.005 mA 0.005 mA
Maximum supply voltage (Vsup) - - 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) - - 1.8 V 1.8 V 1.8 V 1.8 V -
Nominal supply voltage (Vsup) - - 2.5 V 2.5 V 2.5 V 2.5 V -
technology - - CMOS CMOS CMOS CMOS CMOS
Terminal surface - - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD -
Terminal pitch - - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.6 mm
Maximum time at peak reflow temperature - - 40 30 30 40 -
width - - 5.62 mm 3.9 mm 3.9 mm 5.62 mm -
Maximum write cycle time (tWC) - - 5 ms 5 ms 5 ms 5 ms -
write protect - - HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
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