M95M01-RMW6TP datasheet, PDF - EEWORLD Datasheet

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M95M01-RMW6TP: Description128K X 8 SPI BUS SERIAL EEPROM, PDSO8; Categorystorage storage; File Size352KB，41 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M95M01-RMW6TP Overview

128K X 8 SPI BUS SERIAL EEPROM, PDSO8

M95M01-RMW6TP Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	SOP, SOP8,.3
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Maximum clock frequency (fCLK)	5 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
memory density	1048576 bi
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	2.5 mm
Serial bus type	SPI
Maximum standby current	0.000003 A
Maximum slew rate	0.005 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	5.62 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE

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M95M01-R M95M01-W

1 Mbit serial SPI bus EEPROM with high speed clock

Datasheet

−

production data

Features

■

Compatible with SPI bus serial interface

(Positive Clock SPI modes)

Schmitt trigger inputs for enhanced noise

margin

Single supply voltage: 1.8 V to 5.5 V

High speed

– 5 MHz clock rate

– 5 ms Write time

Status Register

Hardware Protection of the Status Register

Byte and Page Write (up to 256 bytes)

Self-timed programming cycle

Adjustable size read-only EEPROM area

Enhanced ESD Protection

More than 1 000 000 Write cycles

More than 40-year data retention

Packages

– ECOPACK® (RoHS compliant)

SO8W (MW)

208 mils width

■

SO8N (MN)

150 mils width

TSSOP8 (DW)

169 mils width

WLCSP (CS)

March 2012

This is information on a product in full production.

Doc ID 13264 Rev 8

1/41

www.st.com

Contents

M95M01-R M95M01-W

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

Serial Data output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Connecting to the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.1

SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1.1

4.1.2

4.1.3

4.1.4

Operating supply voltage V

CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.2

4.3

4.4

4.5

Active Power and Standby Power modes . . . . . . . . . . . . . . . . . . . . . . . . . 13

Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Data protection and protocol control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.1

6.2

6.3

Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.3.1

WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2/41

Doc ID 13264 Rev 8

List of tables

M95M01-R M95M01-W

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Write-protected block size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Status Register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Address range bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Operating conditions (M95M01-R6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Operating conditions (M95M01-W3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

DC characteristics (M95M01-R6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

DC characteristics (M95M01-W3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

AC characteristics (M95M01-R6 and M95M01-W3, V

≥

2.5 V) . . . . . . . . . . . . . . . . . . . 31

AC characteristics (M95M01-R6, V

< 2.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

SO8 narrow – 8 lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

SO8W – 8 lead plastic small outline, 208 mils body width, package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 37

WLCSP – 8 bump wafer length chip scale package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

4/41

Doc ID 13264 Rev 8

M95M01-R M95M01-W

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

SO connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

WLCSP connections (bottom view, bump side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Bus master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write Enable (WREN) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write Disable (WRDI) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Status Register (RDSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Write Status Register (WRSR) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Read from Memory Array (READ) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Byte Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Page Write (WRITE) sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Serial output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 35

SO8W – 8 lead plastic small outline, 208 mils body width, package outline. . . . . . . . . . . . 36

TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 37

WLCSP – 8 bump wafer length chip scale package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Doc ID 13264 Rev 8

5/41

M95M01-RMW6TP Related Products

	M95M01-RMW6TP	M95M01-R	M95M01-R_08	M95M01-RMN6G	M95M01-RMN6TG	M95M01-RMW6P	M95M01-RCS6TP/A
Description	128K X 8 SPI BUS SERIAL EEPROM, PDSO8	128K X 8 SPI BUS SERIAL EEPROM, PDSO8	128K X 8 SPI BUS SERIAL EEPROM, PDSO8	128K X 8 SPI BUS SERIAL EEPROM, PDSO8	128K X 8 SPI BUS SERIAL EEPROM, PDSO8	128K X 8 SPI BUS SERIAL EEPROM, PDSO8	IC EEPROM 1M SPI 16MHZ 8WLCSP
memory width	8	8	8	8	8	8	8
Number of terminals	8	8	8	8	8	8	8
Maximum operating temperature	85 °C	85 Cel	85 Cel	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 Cel	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C
organize	128KX8	128K X 8	128K X 8	128KX8	128KX8	128KX8	128KX8
surface mount	YES	Yes	Yes	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM
Is it Rohs certified?	conform to	-	-	conform to	conform to	conform to	conform to
Maker	STMicroelectronics	-	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	SOIC	-	-	SOIC	SOIC	SOIC	-
package instruction	SOP, SOP8,.3	-	-	SOP, SOP8,.25	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	-
Contacts	8	-	-	8	8	8	-
Reach Compliance Code	compli	-	-	compli	compli	compli	unknown
ECCN code	EAR99	-	-	EAR99	EAR99	EAR99	-
Maximum clock frequency (fCLK)	5 MHz	-	-	5 MHz	5 MHz	5 MHz	-
Data retention time - minimum	40	-	-	40	40	40	40
Durability	1000000 Write/Erase Cycles	-	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	-	-	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	S-PBGA-B8
JESD-609 code	e4	-	-	e4	e4	e4	-
memory density	1048576 bi	-	-	1048576 bi	1048576 bi	1048576 bi	1048576 bit
Memory IC Type	EEPROM	-	-	EEPROM	EEPROM	EEPROM	EEPROM
Humidity sensitivity level	1	-	-	1	1	1	-
Number of functions	1	1	1	1	1	1	-
word count	131072 words	-	-	131072 words	131072 words	131072 words	131072 words
character code	128000	-	-	128000	128000	128000	128000
Operating mode	SYNCHRONOUS	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	-	SOP	SOP	SOP	BGA
Encapsulate equivalent code	SOP8,.3	-	-	SOP8,.25	SOP8,.25	SOP8,.3	BGA8,3X3,47/24
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE	-	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	GRID ARRAY
Parallel/Serial	SERIAL	-	-	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	-	-	260	260	260	-
power supply	2/5 V	-	-	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.5 mm	-	-	1.75 mm	1.75 mm	2.5 mm	-
Serial bus type	SPI	-	-	SPI	SPI	SPI	SPI
Maximum standby current	0.000003 A	-	-	0.000003 A	0.000003 A	0.000003 A	0.000003 A
Maximum slew rate	0.005 mA	-	-	0.005 mA	0.005 mA	0.005 mA	0.005 mA
Maximum supply voltage (Vsup)	5.5 V	-	-	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage (Vsup)	1.8 V	-	-	1.8 V	1.8 V	1.8 V	-
Nominal supply voltage (Vsup)	2.5 V	-	-	2.5 V	2.5 V	2.5 V	-
technology	CMOS	-	-	CMOS	CMOS	CMOS	CMOS
Terminal surface	NICKEL PALLADIUM GOLD	-	-	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	-
Terminal pitch	1.27 mm	-	-	1.27 mm	1.27 mm	1.27 mm	0.6 mm
Maximum time at peak reflow temperature	40	-	-	30	30	40	-
width	5.62 mm	-	-	3.9 mm	3.9 mm	5.62 mm	-
Maximum write cycle time (tWC)	5 ms	-	-	5 ms	5 ms	5 ms	-
write protect	HARDWARE/SOFTWARE	-	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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